Printed Circuit Design & Fab Online Magazine - New Products

New Products

TC-4525 thermally conductive gap filler provides processability and thermal management in automotive electronics applications. Delivers thermal conductivity of 2.5W/m.K, improved dispensability, and reduced abrasiveness. A soft, compressible, two-part silicone; can be dispensed directly from its original packaging with minimal to no additional process preparation. Suitable for automated dispensing using standard meter mix equipment. Good thixotropic properties; avoids slumping on vertical surfaces during assembly. Maintains vertical stability post-cure. Optional formulation incorporates glass beads to control bond line thickness during assembly. Has fast, controlled cure at room temp.; cure times can be accelerated with heat. Requires no post-cure steps, withstands peak exposure at 200°C. Performs reliably at operating temp. up to 150°C.

Dow Corning, www.dowcorning.com

CR-8000 System Planner has enhanced hierarchical and module-based system design capabilities. Optimizes interconnection of system boards created by multiple users. Design Gateway feature allows constraints design and reuse by multiple team members. Collaborative constraints design and reuse help reportedly reduce design time and improve design efficiency. Constraint information for each functional block is now directly associated with block circuit. Constraints can now be managed at the block level, and constraints associated with reuse circuits are reusable. CR-8000 Design Force and DFM Elements output to IPC-2581B. Interfaces support system design with Simulink and boundary scan with JTAG integration to check original design intent and quality achieved. Information shared concurrently among all engineering disciplines from circuit design to layout.

Zuken, www.zuken.com/cr-8000

Optymo 4.4 BoM and parts management software features enhanced quotation module that allows fast sending of RFQs and price and lead-time comparisons. "Min/max" feature now rapidly computes unit and total costs for various quantities of a given BoM, calculates excess costs and remaining components, depending on volumes and packaging. Presents results in graph format. Integrates a relational datase based on a client/server structure. Includes faster data transfer.

Inlynk, www.inlynksoft.com

IS350MD series halogen-free laminates and prepregs has a Dk of 3.51, for ultrathin dielectric applications such as high-end mobile devices. Is an FR-4 type base material with a resin matrix; is based on a modified epoxy resin reinforced with conventional E-glass fabric. Meets flammability class V-0 per UL-94 without addition of antimony compounds. Contains no halogens, and is said to display greater thermal stability than standard FR-4. Can be tailored to any thickness. Requires a short press cycle and does not require plasma for desmearing.

Isola Group, www.isola-group.com/products/is350md/

Altium Designer 15.1 includes features to improve design efficiency with expansions to productivity, documentation, and high-speed design. High-speed design configurations for length matching rules can now be configured in an easy-to-use wizard that automatically accounts for T-branches, components, signal pairs, and groups, greatly reducing the time spent on setup for high-speed designs. Exports PCB designs as 3D PDFs, allowing viewing and rotating with a compatible PDF viewer. Navigates boards with individual component selection, providing greater accuracy and design intent to fabricators. Surface layers for rigid-flex designs can now be added with “bikini” coverlays that are fully visible in 3D and can be configured with specific material needs. Coverlay edge clearance and expansion rules have also been added to the design rule options, providing users with precise control over coverlay applications. Pad and vias can be easily be managed in a pad and via library, allowing users to define custom templates for pad shape and size. Templates can then be applied to specific groups of pads on a PCB for easy application, saving countless hours defining pad options individually. New Unions panel helps to better organize design data and align Union data with other PCB objects in a design. The Union panel will show a hierarchical view of Union types, Unions, and Union primitives for easy reference.

Altium, www.altium.com

Kozio VTOS Scan tool automates the process of creating new configurations, enabling verification of new board designs, new product introductions, and full volume manufacturing test. Built using VTOS embedded software for hardware verification, is said to accelerate the process of configuring new embedded tests, while providing previously tested built-in verification commands. Uses minimal system-on-chip (SoC) resources to provide a stable on-device application for hardware configuring, hardware interface testing, and controlling all bus-based devices, without compiling code and embedded device restarts. Pin mux configuration, driving signals, interfacing with bus devices, and hardware interface testing is performed at run time without compilation and system restarts. Is said to be easy to install. UI makes it easy to configure board-specific settings, automatically scan for bus devices and add them to the test configuration, and add test commands for board-specific use cases.

Kozio, kozio.com/vtos-scan