HSIO validation assistant is a data mining tool for ScanWorks. Automatically analyzes database of signal integrity test data and quantifies risk associated with potential design flaws or poorly performing devices on a system’s high-speed input/output (HSIO) buses. Organizes and correlates validation database to identify vulnerabilities. Redundant validation testing can be identified and eliminated. ScanWorks HVA has been integrated into ScanWorks HSIO; validates signal integrity on high-speed buses on Intel circuit board designs.
Asset InterTech, www.asset-intertech.com
IPC-A-600 PCB Process Sequence Kit is an aid for teaching the IPC-A-600 Acceptability of Printed Boards Training and Certification Program. Contains boards that represent steps in the PCB fabrication process, documentation describing the process steps, and care and handling instructions.
STI Electronics, www.stielectronicsinc.com
NI AWR Design Environment v. 12.01 offers new amplifier-, antenna- and radar-specific features, as well as ease-of-use improvements, speed enhancements and additional third-party integration flows. Includes additions to load-pull capabilities and improvements to system simulation within Visual System Simulator software, layout, tuning, yield analysis and optimization capabilities.
National Instruments, www.awrcorp.com/v12
Parts Concierge virtual assistant allows hardware engineers to request any part be built and added to their design on their behalf. Parts are created by Upverter component engineers, in real-time. Upon adding a part to a design, the part will be built in real-time. Frees engineers from creating and verifying schematic symbols and footprints for any electronic component. All requested parts are verified for accuracy and join a parts library accessible to all users.
Upverter, upverter.com
Microwave Impedance Calculator now includes additional dielectric materials, thermal model capabilities, and bug fixes. Software is intended to assist with microwave circuit design in predicting the impedance of a circuit made with high-frequency circuit materials. Has capability to predict transmission line losses. Determines predicted impedance and other electrical information. Uses closed form equations to determine impedance and loss. Loss calculation is divided into conductor loss and dielectric loss. Also predicts wavelength, skin depth and thermal rise above ambient.
Rogers Corp., www.rogerscorp.com
Three Wavelength series Ledia direct imaging (DI) systems are for high-speed exposure of solder mask and innerlayer and outer-layer resists. These five and six exposure head systems combine 365, 385 and 405nm wavelength LED emissions. Reportedly deliver 15µm lines and spaces with well-defined edges, with improvements in throughput.
Ucamco, www.ucamco.com