M2 Blizzard is a small-spot X-ray fluorescence (XRF) spectrometer designed for nondestructive analysis of printed circuit boards, in accordance with ASTM B568 and DIN/ISO 3497 standards. Uses XSpect Pro and XData software, it enables characterization of metal multilayer systems, consisting of up to 12 layers with up to 25 elements each. Slotted sample chamber and large tray support precise positioning of all types of PCBs. Comes with a high-performance silicon drift detector suitable for analysis of thinner layers and unknowns, as well as for routine analysis. Comes with video microscope system with auto-focus. Has pass/fail determination or trend line display with upper and lower control limits. Reporting and data archiving functions are included, as well as data export to Excel. Optional foot switch and touchscreen operation.

Bruker, www.bruker.com

Sarcon SG-26SL is a thermally conductive and electrically non-conductive silicone-based compound that has a thermal conductivity of 2.6W/m°K when dispensed between a component (such as a CPU or power converter) and a heat sink. Is for thin bond line applications. Removable by wiping with a cloth. Reportedly delivers consistent performance across temperatures ranging from -55°C to 205°C. Packaging options include prefilled syringes and bulk jars for manual or automated dispensing applications.

Fujipoly America, www.Fujipoly.com

HyperLynx Signal Integrity/Power Integrity (SI/PI) adds power-aware SI simulation capabilities for accurate modeling and signal performance of high-speed parallel links such as DDR3 and DDR4. Is for high-speed printed circuit board designs. Power-Aware IBIS v5.0 modeling reportedly ensures accurate simulation of simultaneous switching noise and power effects of timing and signal integrity. DDRx Wizard supports the latest JEDEC standards to verify all DDR and LPDDR memory types. Integrated S-parameter extraction and simulation is reportedly accurate and 5 to 10 times faster. High-performance DC drop/thermal co-simulation predicts voltage drop, high current areas, and temperature changes. Addresses high-speed system design problems throughout design flow. Provides tools for pre- and post-layout signal integrity, timing, crosstalk and power integrity analysis to generate accurate simulation results to prevent design re-spins. Models supply currents, including pre-driver effects, switching slowdown due to sagging supply voltage, and better buffer capacitance modeling.

Mentor Graphics, http://www.mentor.com/pcb/hyperlynx/

PU 1000 single-part adhesive cures quickly at room temp. to a flexible, electrically conductive polymer. Cures in 10 min. at 23°C. Can replace traditional epoxies. Is an electrically conductive polyurethane that addresses applications in die attach, bonding of components in hybrid circuit applications and SMT. Is for bonding of flex-circuits, temperature-sensitive substrates or substrates with highly dissimilar coefficients of thermal expansion. Applications include smart cards and RFID circuitry.

Polytec PT, http://www.polytec-pt.de/int/