Thru-Cup MSC-PS acid cleaner is for cleaning and increased wetting of high aspect ratio plated through-holes and microvias. Reportedly has superior detergency and low surface tension that provides for electroplated copper adhesion and void-free coverage. Is designed as a drop-in replacement process for vertical copper electroplating applications. Has minimal copper etching and does not attack or damage dry film resists.
Uyemura USA, www.uyemura.com
85HP high-performance polyimide laminate and prepreg material has a Tg of 250°C. Is based on 85N polyimide resin. Uses spread glass styles and a micro-fine filler system. Reportedly offers 2x thermal conductivity vs. other polyimide resin systems. Is ideal for use in high-temperature applications such as burn-in semiconductor testing and down-hole drilling. Use of spread glass reinforcements with a filled polyimide resin system results in laminates with X-Y CTE values close to that of copper (16-18 ppm/°C) and a low Z-axis expansion.
Arlon Electronic Materials, www.arlon-med.com
NTwC (New Transport with Clamping) Electro Plater provides automatic, contact-free, horizontal transport of printed circuit boards mounted in clamping frames. Can be used for flash plating, panel plating, pattern plating, via filling, SAP and mSAP. PCBs with high aspect ratio (> 20:1) and substrates down to 25µm can be processed. Also works with boards up to 3.2mm.
Schmid Group, www.schmid-group.com
Diamond direct imaging system is for printed circuit board solder masks. Features dual table mechanism and flexible scaling modes. Uses high power light source. Wide wavelength spectrums to ensure fit for conventional solder resists. Addresses solder mask manufacturing needs of high-density interconnect and multilayer boards.
Orbotech, www.orbotech.com
Coolit v.15 computational fluid dynamics software predicts airflow and heat transfer in electronics equipment and CoolitPCB v.15 printed circuit board board-level thermal analyses tool deliver an order of magnitude increase in user interface speed when working with complex CAD-imported objects. Major improvements to the solver include up to 40% solution time cut for most problems, and an up to a 50% boost for forced convection flows with difficult (multivalued) fan curves. Model construction efficiency has improved with the addition of a second window option to the system, which is particularly effective when using more than one computer monitor.
New functionality includes Joule heating, precise layer positioning for PCBs and support for circular/oval PCBs. Viewing computed results and generating reports is said to be easier due to enhanced CoolPlot integrated visualization tool. CoolPlot now includes new Probe components and the ability to write annotations on still images. Now automatically saves viewing configuration.
Other improvements introduced in v.15 are a streamlined user interface for fan modeling and increased convergence rates for free convection flows. The quality of exported videos and stills has also been enhanced. Both tools work with Windows.
Daat Research Corp., daat.com/PCBjump.php