Speedstack PCB layer stackup design system is now available in German, Japanese, simplified Chinese and traditional Chinese versions. Can create and document stackups for high-density interconnect (HDI) and flex-rigid printed circuit boards. Can fine-tune stackup design by assessing the impact of different PCB materials on cost, performance and manufacturing yield. Stackup data can be exported in different industry-standard formats and shared.

Polar Instruments, www.polarinstruments.com

 

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article