VisualCAM Stencils v. 16.7 design tool streamlines and automates stencil/paste designs generation. New release defines paste shapes using pitch rules. Features enhanced library management, improved identification and shape assignments, and improved paste generation and reporting. Includes many new macro commands and a powerful macro developer to aid in automation, data preparation and stencil generation.
Wise Software Solutions, wssi.com
Register now for PCB West, the Silicon Valley's largest trade show for printed circuit board design, fabrication and assembly: Sept. 15-17 at the Santa Clara Convention Center pcbwest.com
CR-8000 2015.1 single and multi-board design software performs true 3D checks of multi-board designs can be carried out against all aspects of a product, including the enclosure. Includes improved accuracy in layer configuration design work through transfer of layer configuration data with Polar Instruments Speedstack. Design Force enables design teams to create any design from quick prototype boards to complex, multi-board systems using a single tool. Improves accuracy of 3D checks by using a true 3D component model with a precisely-matched 3D shape, rather than a shape defined by a boundary box. Accurate shape parts can be used for collision checks and 3D clearance checks. Layer configuration data can be transferred to Speedstack, removing the need to re-input stackup data. Creates line shapes considering the production yield ratio and signal quality. When routing with the track/route differential pair/bundle route command, the track width now changes automatically on boundary of a rule area. New export formats for outputting waveforms in the waveform viewer, improving efficiency in documenting and reporting signal results for engineering information and review.
Zuken, www.zuken.com/cr-8000
See Zuken and CR-8000 2015.1 on Sept. 16 at PCB West at the Santa Clara Convention Center!
IsoPro 3.2 software produces isolation data in G-Code format, permitting the manufacture of printed circuit boards on Quick Circuit in an hour from the time schematic and layout are completed. Upgraded Contact-by-Touch feature on Quick Circuit QCJ5 calibrates depth of cut with the tool touching off the surface of material in an average of 5 sec. from the time the tool has changed. Enhanced Real time milling progress allows automatic alignment of multilayer PCBs in the lab.
T-Tech, t-tech.com
Learn more about IsoPro 3.2 at PCB West on Sept. 16 in the Santa Clara Convention Center, CA.
Pantheon Ink Resistor functionality enhancements include the ability to create rectangular and complex ink resistor shapes parametrically during layout, or from information obtained from a schematic. Components reside in the design database as parametric types, allowing flexible modifications as needed during design. Manipulates individual ink resistor layers, whether internal or external. Defined parametric properties can be saved for use in any design; auto-generates ink resistors based on given inks. Creates ink resistor shapes from ink resistor calculation formulas or flexible dialog options. Generator Dialog includes a preview window that updates as ink resistor attributes are modified. For laser trim parameters, offers full functionality with options for passive and functional trim. Other options include specifying static and/or dynamic trim clearances for placement and routing. Sets resistor tolerances and trim percentages for flexibility in ink resistor creation.
Intercept Technology, www.intercept.com
Register now for PCB West, the Silicon Valley's largest trade show for printed circuit board design, fabrication and assembly: Sept. 15-17 at the Santa Clara Convention Center pcbwest.com
Studio Suite 2016 now comes with Characteristic Mode Analysis integral equation solver.
SMT Radsert compact, high current printed circuit board power connector enables power delivery of 35A to 200A. Reportedly can accommodate any dimensional constraint and stack height. For use in energy storage systems, high-current, and single-point connections. Comes in tape-and-reel packaging for high-volume applications. Brings power to a board from busbars suspended above or below the board and its components. Comes in press-fit and solder versions. Novel pin and socket technology is high-reliability, durable, high current, low mating force, and has higher amperages within smaller footprint.
Amphenol Industrial Products, www.amphenol-industrial.com