N7660B Signal Studio software is for multi-emitter scenario generation. Provides multi-emitter signals downloadable to one or more Keysight N5193A UXG agile signal generators for testing of electronic countermeasures systems. With the MESG capability, it reportedly simplifies threat interleaving for ECM system test applications such as sorting and identification, subsystem interface management and threat correlation. Graphical user interface permits configuration of radar parameters such as frequency, amplitude and pulse width, and then interleave multiple radar emitters. Can combine radars into scenarios using dropped-pulse reports. Can reduce pulse collisions by changing emitter start times, priorities and pulse-repetition intervals, by toggling emitters on and off, and by adding more UXG signal generators to the simulation. Can download multi-emitter scenarios directly to one or more UXGs as pulse descriptor word lists. UXG provides phase-coherent frequency and amplitude transitions as fast as 180ns, timing resolution of 2ns, and dynamic range of -70dBc.

Keysight Technologies, www.keysight.com

Sherlock Automated Design Analysis software v. 4.0 models complex printed circuit boards and components.  Features include FEA integration tools, lead modeling of surface mount and through-hole components, substrate trace modeling, shock scoring, an expanded cutout editor, and a heatsink editor. Has Substrate Trace Modeling and integration with Abaqus and ANSYS Workbench. Models all substrate features. Lead Modeler and Heatsink Creator now automatically specify lead structures and heatsink architecture and attach for all electronic parts. Includes Shock Scoring for assessment performance of electronics subjected to repeated shock.

DfR Solutions, www.dfrsolutions.com

S3 10µm Substrate Tester has four freely movable test heads and a test rate of 100 measurements per sec. for high-speed open and short tests. Optically aligns test sample, correlating shrinkage and offset of finished product with testing data and adjusts automatically. Has 5Mp color camera with resolution of 1.2µm, good for positioning accuracy of +/-1.5µm. Contacting pressure of micro needle adjusts from 0.3g to 2.5g. Maximum test area 310 x 300mm (12.2" x 11.8").

atg Luther & Maelzer, www.atg-lm.com

Xpedition Package Integrator flow performs integrated circuit, package, and printed circuit board co-design and optimization.