Printed Circuit Design & Fab Online Magazine - New Products

New Products

Flowmaster simulation software for thermo-fluid systems now has a functional mock-up interface (FMI) that enables usage of Flowmaster models in an open-source environment. Includes export capability. Provides enhanced secondary air solver and natural circulation capability. Secondary air feature provides solver algorithms that improve the stability and accuracy of modeling flow through rotating parts. Natural circulation capability simulates fluid circulation in a closed loop system without a pump through gravity and heat energy changes. Parametric studies capability now provides users with greater flexibility in setting up design study inputs. Smart modeling is enabled. Monte Carlo simulation functionality now includes random value generation for each instance of a parameter and individual calculation of mean, sigma, minimum and maximum. Monte Carlo simulation provides examination of small thermal variation effects in input values.

Mentor Graphics, http://www.mentor.com/products/mechanical/products/flowmaster

LMT is a light-duty, motorized ergonomic multi-purpose worktable. Is suited for light industrial, laboratory, light assembly, quality control, packaging and technical offices. Is designed to meet ergonomic standards for users in both seated and standing positions. Table frame is adjustable by using an integrated linear actuator system, providing height adjustment from 25.39” to 45.08”. A 1”-thick worktop is included in non-ESD or ESD options. Accessories are available using upright modules M40, M48 and M60. Load capacity is 330lbs, evenly loaded. Load capacity of the uprights is 176lbs, evenly loaded.

Sovella USA, www.sovella.us

E³.HarnessAnalyzer, for the automotive harness industry, is for viewing and analyzing harness drawings in the standard HCV container data format, which combines KBL (physical data model) and SVG (vector graphics) data. Supports efficient collaboration through powerful analysis, redlining, and version compare functionality. Provide greater ease-of-use when sharing comprehensive harness design models and documents with internal or external project teams. Is based on Intedis platform.

Zuken, www.zuken.com/transportation

EnFILL Copper Via Fill systems are for HDI any-layer buildups. Reportedly offer a high current capacity proven to reduce cycle time by up to 40%, while providing via fill capacity with minimal dimple. Are engineered for vertical conveyorized plating.

Enthone, www.enthone.com/enfill/

Xpedition Systems Designer software for multi-board systems connectivity captures the hardware description of multi-board systems, from logical system definition down to individual PCBs, automating multi-level system design synchronization processes for team collaboration with accuracy and faster design productivity. Captures complete logic system definitions in systems of up to multiple boards, cables and other elements (backplane, cable assemblies, sensors and actuators). Unique design "cockpit" enables system-wide partitioning of logical system blocks into individual PCBs. Fully supports concurrent design, enabling team members to simultaneously engineer and collaborate on different components of the system. System architectures created in Visio can by imported to accelerate system capture. Advanced synchronization work-in-progress design data enables multiple engineers to concurrently collaborate on the logical system level, as well as within the lower-level PCB projects. Systems can be partitioned into multiple board projects and associated connectivity. Automated connectivity synchronizes changes across the system, enabling "what-if" re-partitioning exercises to optimize the system for performance, size and cost. Features on-the-fly creation of parameterized connectors. Automated connector mating and pin pairing, as well as synchronization between PCB projects and system design data, eliminates connector errors throughout the design cycle. Automates connectivity definition and verification, and traces signals across the entire system to ensure that connectivity is as specified.

Mentor Graphics, http://www.mentor.com/pcb/xpedition/systems-design/

AVIA NX series of q-switched, diode-pumped, solid-state lasers offer output powers up to 40W at 355nm. Are said to be smaller, lighter, and more robust than other UV lasers of the same power level. Feature patented pumping technology of the Nd:YVO4 gain medium, for increased overall system efficiency (conversion of input electrical energy into usable light). Also incorporates novel optical mounting technology, for enhanced stability and long-term reliability. For PCB via hole drilling, drilling and cutting of flex materials, 3D IC chip fabrication, IC chip package trimming, as well as other processes in support of system-in-package (SiP) manufacture.

Coherent, www.coherent.com.