CupraEtch SR surface pretreatment is said to maximize adhesion of dry and liquid soldermasks and photoresists. Sustainable and robust copper treatment; can also be used for photoresist pretreatment for innerlayers and outerlayers by employing a lower etch depth. Low-temperature, three-step-process is based on cupric chloride etch. Is suitable for tenting, pattern plating and conveyorized application of thin material handling. Is compatible with multiple copper types, a variety of soldermasks, and selective finishes such as ImSn (immersion tin) and ENIG (electroless nickel immersion gold). Copper loading capacity of up to 40g/L, for reduced feed and bleed needs.

Atotech, www.atotech.com

Designer 15 printed circuit board and electronic system level design software comes with novel Pin Pairs feature to enable accurate length and phase tuning across termination components; and enable length, phase and delay tuning traversing an entire signal path. Is said to eliminate need to have external software to maintain complex lists of signals and nets, but instead allows planning and routing groups of high-speed nets with greater efficiency and accuracy. Supports IPC-2581 and Gerber X2.

Altium, www.altium.com

Studio Suite 2015 electromagnetic simulation tool includes new features for radar cross-section (RCS) simulation. Adds ability to produce RCS maps - plots of RCS phase or amplitude against frequency and scan angle - with the shooting and bouncing ray (SBR) asymptotic solver.  Gives a more detailed view of the cross-section of a platform, and can be used to help identify potential scatterers. Also introduces support for angle and frequency-dependent radar absorbing material (RAM) coatings. 

CST (Computer Simulation Technology), www.cst.com

µFlex Series multi-axis precision laser micromachining platform, Is  configurable to accommodate a variety of laser wavelengths, powers, and pulse widths, from nanosecond to femtosecond, to optimize processes for a broad spectrum of materials. Novel real-time control system synchronizes timing of laser pulses with laser beam positioning and movement of work surface. Footprint is as small as 1.7 sq. m. Accepts a range of industry-standard automation technologies for loading and unloading parts. Options for ultraviolet, infrared, CO2 and green lasers. For laser drilling applications in consumer electronics, medical devices, automotive components, and other industries.

ESI, http://www.esimicroflex.com