Printoganth MV TP1 electroless copper bath provides high throwing power into blind microvias, enabling ultra-fine lines and spaces of 10/10µm and below. Is said to be a drop-in solution and fully compatible with Atotech desmearing and activation processes for SAP technology. Throwing power values typically 100% on the capture pad and 70% in the wedges for 50/50µm and 60/40µm blind microvias on ABF GX-92 laminates. Deposits feature a favorable surface morphology for better dry film adhesion and etchability performance. Passed reliability tests such as TCT (Thermal Cycle Test), IST (Interconnect Stress Test), QVP (Quick Via Pull Test) and SST (Solder Shock Test).
Atotech, .atotech.com/products/electronics/news-single-view/article/printoganth.html
LAS 260 particle filter features F9 pleat filters for large storage capacity, leading to less downtime and reduced maintenance and operating costs. Filtration efficiency for fine dust (DIN EN 779) and suspended solids (DIN EN 1822) up to 99.995%, as well as gases, vapors and odors. Removes harmful particles at small lasers, laser marking and ultra-short pulse laser processing. Can be used in automated and semiautomated processes standalone or inline. Stepless adjustment of airflow.
ULT AG www.ult.de
Smartlam 5200 automatic cut sheet laminator is designed for processing ultra-thin materials with the option of wet lamination in a high-volume production environment. Is designed around tacking system; is made of redesigned conveyors, centering unit and devices that allow handling of material in and out of the lamination rollers at the tacking point. Wet lamination system has a new design. Updated software offers greater flexibility in setting processing parameters. Lamination of substrates up to 12mm is possible.
Dynachem, www.dynachem.eu
EMSAT Viewer pairs EMSAT post-layout EMC and SI design rule checkers developed by IBM with a Pantheon EMSAT Viewer that displays each violation on the board in real-time. Includes tree view that mimics EMSATuser interface, along with descriptive error reporting. Tree view is interactive, allowing users to view a report on errors or click through each error to view the violation on the board. Violations are displayed using arrows and highlight objects. Viewed errors display in gray italics. Corrections can be made directly in Pantheon and exported back for analysis in EMSAT using the DSN output file. Checks for common violation types in a layout that lead to EMC or SI degradation. Rule types can be tailored to each design. Rule checking is accomplished by reading in .brd, .dsn, .hyp, .mcm, or .xml; critical objects in the layout are designated, such as I/O nets, power/ground nets, clock nets, and decoupling capacitors; then each of the EMSAT rules are run on the design, and errors are reported and stored in output files. Pantheon can use one of 35+ database translators in tandem with EMSAT viewer and EMSAT violation file.
Intercept Technology, www.intercept.com
SpiCalci simulation software calculates performance characteristics and parameters for switch mode power supply (SMPS) capacitors. Features enhanced part selection and includes nearly all new SMPS devices introduced by AVX over the past two years. Allows inputting of raw data and generates output information and graphs to aid in SMPS capacitor selection. Accepts inputs and selects a variety of raw data, including: part type, case size, voltage, dielectric, capacitance, tolerance, ambient temperature (°C), temperature rise (°C), and operating frequency (kHz) for catalog, military, and aerospace parts. Output data is provided in two categories: Specifications for this Design and Specifications Varying with Temperature. Is free of charge.
AVX Corp., www.avx.com/SpiApps/default.asp#spicalci
LIOELM TCL500 / TSU 500 series low dielectric materials are said to reduce transmission losses by using an original low dielectric resin. Contribute to the widening of printed-circuit traces or narrowing gaps between lines. TCL500 consists of 25 micron low dielectric adhesive layer and release film. TSU 500 consists of 12.5 micron photoimageable film, 25 micron low dielectric adhesive layer and release film. Copper adhesion strength is 10 n/cm, Dk is 2.55 @ 1 or 5GHz, and dissipation factor is 0.006 at 1GHz and 0.004 at 5GHz.
Tokyo Ink, http://www.nagase.co.jp/display/english/pdf/fpd2014/toychem.pdf