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LPKF Releases MicroLine 2820P Laser Depaneler

Published: 20 January 2015

MicroLine 2820P laser depaneler cuts PCB panels and cover layers. Is said to reduce lead times and eliminate tooling costs of layout changes. Holds substrates securely on vacuum table. Is for depaneling, cutting and engraving a variety of substrates (cover layers, rigid, flex and rigid-flex).

LPKF, www.lpkfusa.com

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