Optymo 4.3 is a BOM and parts management software that organizes design and production steps. In this updated version, Optymo can share operational data with Altium Designer, and it is now possible to share a BOM between the two tools without using the “import” function. Can copy the BOM in Altium Designer and paste it in Optymo. Optymo user can search for a new component in one click. If the part has been used in a previous design, it will appear immediately with its full history. Pick preferred part and click on icon to create the part in the database. Component information is displayed in Altium Designer. Optymo imports all potential suppliers with a manufacturer reference.

Inlynk, www.inlynksoft.com

OsmondCocoa v. 1.1.28 PCB design software comes with complete library of text characters by default if other text libraries are not available. Fixes issues that could cause opaque white patches to appear, particularly with Yosemite, when performing peg dragging or clearance checking operations. Full trace length of trace nearest cursor is now automatically displayed at the upper right, along with the X and Y position of the cursor. Two new Lua commands: "path_to_file()", and "path_to_directory()", return strings that contain the full path to the design file and to the directory that contains the design file, respectively. Fixes a bug that could cause a trace or a portion of a trace to not highlight correctly when performing a clearance checking operation.

Osmond PCB, www.osmondpcb.com

A8a test system comes with eight test heads and four cameras for optical alignment. Tests pad sizes down to 35 microns. Test area is 18" x 12". Eliminates limitations of test point density or fine-pitch contacts. Features embedded component test or a 4-wire Kelvin measurement with an accuracy of +/-0.025 mΩ. Comes with separate good and bad board stacker. Bad boards can be optionally labeled by a 2D code indicating reference between the boards and corresponding fault file. Feeder capacity of 390mm. Dual shuttle system reduces product exchange time to less than 4 sec. in automation mode.
 
atg Luther & Maelzer, www.atg-lm.com

Via Dep 4550 electroless copper reportedly provides blister-free electroless copper deposits on polyimide, flexible printed circuit boards, Kapton, Teflon, plated-over-filled vias, and high Tg epoxy laminates. Has nearly zero internal stress and excellent adhesion. Passes thermal cycling test (IPC-TM-650, 2.6.26A) and thermal stress (IPC-TM-650, 2.6.8E) requirements. Is designed as a drop-in replacement process for vertical and horizontal applications. The chelation system is tartrate-based and has no cyanide or heavy metals.

OM Group, www.omgi.com/