TC-4525 thermally conductive gap filler provides processability and thermal management in automotive electronics applications. Delivers thermal conductivity of 2.5W/m.K, improved dispensability, and reduced abrasiveness. A soft, compressible, two-part silicone; can be dispensed directly from its original packaging with minimal to no additional process preparation. Suitable for automated dispensing using standard meter mix equipment. Good thixotropic properties; avoids slumping on vertical surfaces during assembly. Maintains vertical stability post-cure. Optional formulation incorporates glass beads to control bond line thickness during assembly. Has fast, controlled cure at room temp.; cure times can be accelerated with heat. Requires no post-cure steps, withstands peak exposure at 200°C. Performs reliably at operating temp. up to 150°C.

Dow Corning, www.dowcorning.com

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