SpiTAN IV web-based simulation tool for tantalum, polymer, and niobium oxide capacitors features data mined from AVX’s previous PSpice models and S-parameters S2P software. Offers a user-friendly program for reviewing critical electrical and performance characteristics for individual part numbers by temperature and frequency, for identifying and selecting the optimum capacitors for an application. Searchable by part number or product type — the list of which currently includes: low profile, high CV, low ESR, polymer, niobium oxide, and high reliability capacitors — results can be refined by capacitance, rated voltage, case size, and ESR. Frequency and temperature can be manipulated on interactive graphs to access part-specific electrical and performance data over frequency, including: capacitance, ESR, DF, impedance, ripple voltage, and ripple current. Allows inputting of application voltage and temperature information to chart DCL over time, and provides an equivalent circuit diagram with characteristics for each parameter.
Cadstar Board Modeler Lite 9.1 is a full 3D modeler for close collaboration with MCAD. Can import or export mechanical constraints like chassis and heatsinks through STEP, ACIS (SAT), STL or IDF. Can conduct 3D collision checks and measurements; can correct issues and back-annotate changes to MCAD and Cadstar. Reportedly has a 3D model wizard for creating almost any 3D part.
Altium Vault 2.5 enterprise printed circuit board design data management software update reportedly improves automation and management of design data, with updates to component management, data management, project collaboration, and infrastructure management. Reportedly automates data management tasks, and provides greater control and specificity in those domains that rely on human precision and analysis. New features include component update notifications; lifecycle change approvals; NIS deployment packages; automated project notifications, and binary file storage.
Pulsonix 8.5 schematic capture/PCB design software now outputs in Gerber X2 and exports netlists in IPC-2581. New Panel Editor feature controls pre-fabrication processes, enabling multi-PCB designs to be panelized, and adds test coupons, fiducial markers, documentation and fabrication details. Defines tab-routing paths. Multiple group selection for design reuse has been added to enhance current reuse placement algorithm. When a selection has been made, this can now be applied to multiple groups in the design. Once placement has been made, multiple positional rearrangement options can also be applied to the existing design using a new placement pattern from the original design. Introduces dynamic graphical positioning tool for adding STEP models to the footprint, for accurate visual association between the two items.
FloTherm XT software has thermal management capabilities for electronic systems, printed circuit boards and packages. Is an integrated mechanical design automation and electronic design automation electronics cooling solution. Has CAD-centric technology and a mesher that simulates complex geometries. Now supports transient analysis, component and board manipulation, Joule heating, parametric studies, extended EDA integration capabilities, and new modeling options, including an ability to represent copper for complex PCBs. Provides design virtual prototyping and “what-if” analysis for product quality and minimized design iterations. PCB copper nets and traces are represented in 3D.
MCAD Co-Designer extension for Altium Designer facilitates collaboration between mechanical and electronic design with integrated design data, a managed change environment for design revisions, and lifecycle management for component creation. Is said to tightly integrate design data between ECAD and MCAD software environments. Integrates directly with Solidworks to allow mechanical and electrical collaboration without interruptions to existing workflow efficiencies. Features include:
Managed design revisions, for making changes to component placement and board shape in their respective design environments. Changes are then pushed through a new ECAD/MCAD project collaboration server, which notifies the designer of changes made to a design and provides the option to accept or reject changes as desired.
Integrated design data, linked between Altium Designer and a mechanical designer's software environment, for exporting board assemblies to MCAD software with included copper information, allowing thermal, vibration, and other mechanical simulations.
Distinct workflows and lifecycles, to allow existing workflow productivity to be maintained with no interruptions to their design environment. Component models and electrical data can be worked on independently in both design environments, and completed design data can then be joined into a unified component model.
