FloTherm XT software has thermal management capabilities for electronic systems, printed circuit boards and packages. Is an integrated mechanical design automation and electronic design automation electronics cooling solution. Has CAD-centric technology and a mesher that simulates complex geometries. Now supports transient analysis, component and board manipulation, Joule heating, parametric studies, extended EDA integration capabilities, and new modeling options, including an ability to represent copper for complex PCBs. Provides design virtual prototyping and “what-if” analysis for product quality and minimized design iterations. PCB copper nets and traces are represented in 3D.
Mentor Graphics, www.mentor.com
MCAD Co-Designer extension for Altium Designer facilitates collaboration between mechanical and electronic design with integrated design data, a managed change environment for design revisions, and lifecycle management for component creation. Is said to tightly integrate design data between ECAD and MCAD software environments. Integrates directly with Solidworks to allow mechanical and electrical collaboration without interruptions to existing workflow efficiencies. Features include:
Altium, www.altium.com
CST Studio Suite – Student Edition is a free version of this electromagnetic simulation package designed to help with basics of electromagnetic theory. Allows students to visualize electromagnetic phenomena and their applications in 3D. Fully parameterized models allow students to adjust settings of the problem and perform virtual experiments to investigate field behavior. Contains high-frequency time domain and frequency domain solvers, as well as static and thermal solvers. Is supported by online examples showing how problems can be solved with simulation. Includes intuitive modeling interface, material library and field visualization features.
CST, https://www.cst.com/academia
Pantheon now includes integrated Keysight ADS Board Link macros within its design application environment. Permits bidirectional transfer of layouts, schematics and libraries between ADS and enterprise PCB tools. Allows generation of complex parametric ADS components for design layout and geometry creation.
Intercept Technology, www.intercept.com
T-Coin (technology of copper coin insert) structure increases the area available for heat conduction for a limited number of through-holes by inserting cylindrical copper (copper coins) into through-holes without leaving gaps, using a method that minimizes pressure loading. Is compatible with copper coin diameters between 3mm and 6mm and printed circuit board thicknesses between 1mm and 2mm. A copper coin insertion apparatus reportedly ensures uniform pressure when inserting copper coins into through-holes. Reportedly achieves a 20-fold improvement in heat dissipation.
OKI Circuit Technology, www.oki.com
Black and TrueWhite laser markable labels are tested to GMW14573 and GM6121M performance requirements for automotive label applications. Can be ablated by a variety of low power lasers, provide flexible, high-temperature alternatives to polyester and acrylic laser markable labels and are durable. Include high-temperature polyimide films, durable cross-linked polymer coatings, low surface energy pressure-sensitive adhesives and liners for handling and die cutting. Can be ablated by most low-power CO2, YAG, fiber, UV and Vanadate lasers. Adhere to metals, plastics, glass, ceramics and resins.
Polyonics, www.polyonics.com