Speedstack PCB layer stackup design system is now available in German, Japanese, simplified Chinese and traditional Chinese versions. Can create and document stackups for high-density interconnect (HDI) and flex-rigid printed circuit boards. Can fine-tune stackup design by assessing the impact of different PCB materials on cost, performance and manufacturing yield. Stackup data can be exported in different industry-standard formats and shared.

Polar Instruments, www.polarinstruments.com

Ansys Student is a free, introductory academic software package for students interested in learning the fundamentals of simulation, while gaining exposure to simulation workflows, pre-processing, post-processing and solver solutions. Can tackle broad scope of mechanics and fluid simulations, from fundamental tutorial level models to complex real-world scale models. In addition, the company website provides self-guided technical support, installation videos, FAQs and introductory tutorials.

Ansys, www.ansys.com

Thermocomp thermoplastic-based materials offer Df down to 0.001, and a range of Dk from 3 to 13.9, depending on frequency requirements. For transmission conditions from 900MHz to3GHz and beyond, as in base station antennas. Are designed to replace ceramics and PCBs. Are said to offer dimensional stability and low friction, flame resistance and stable Dk within climate conditions ranging from –40C to +55C with 55% humidity. Are capable of complex geometries and miniaturization.

SABIC, sabic.com 

Register now for PCB West, the Silicon Valley's largest printed circuit board trade show, Sept. 15-17. www.pcbwest.com

Ansys 16.2 includes new multiphysics and systems capabilities, such as heat transfer. Enhancements to Simplorer platform for multidisciplinary systems modeling allow assembly and simulation of electrical, electronic, thermo-fluid, mechanical and embedded software components. Offers advanced 3-D precision when needed, as well as reduced-order modeling for verifying multi-domain system performance interaction. Virtually builds, tests and validates prototypes. Supports comprehensive conjugate heat transfer analysis and one-way fluid-structure interaction to compute thermal-stress.

Ansys, www.ansys.com

Register now for PCB West, the Silicon Valley's largest printed circuit board trade show, Sept. 15-17. www.pcbwest.com