Ansys 16.2 includes new multiphysics and systems capabilities, such as heat transfer. Enhancements to Simplorer platform for multidisciplinary systems modeling allow assembly and simulation of electrical, electronic, thermo-fluid, mechanical and embedded software components. Offers advanced 3-D precision when needed, as well as reduced-order modeling for verifying multi-domain system performance interaction. Virtually builds, tests and validates prototypes. Supports comprehensive conjugate heat transfer analysis and one-way fluid-structure interaction to compute thermal-stress.

Ansys, www.ansys.com

Register now for PCB West, the Silicon Valley's largest printed circuit board trade show, Sept. 15-17. www.pcbwest.com

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