A.W.T. World Trade Inc. introduces Accu-Cure UV, curing units designed for high-speed curing of PCBs, as well as other flat and rigid panel substrates. The cooling system lowers heat transmission levels, protecting the substrate and belt.
 
Features include a repositionable curing head with a focused reflector and a gate height adjustment that can accommodate substrates of various thicknesses. Users can choose UV output from the variable position wattage selections: 100-, 200-, 300- or 400-watts per inch.
 
Light guards protect from UV and visible band light; the ozone removal system removes hot air and ozone from the work area. During rapid curing, substrates are protected and positioned by the vacuum holddown system. The unit is reported to be very quiet.
 
Curing widths are available from 12 in. to 100 in., and conveyor lengths start at 5 ft. The units can be single or double lamped and have Gallium lamp or 400W upgrades available. Quartz polished glass, a recessed parts conveyor and additional sections by the foot are offered. 
 
The unit is available in several configurations, including a vacuum holddown retro-fit package, curing head with light guard assembly and a complete UV curing system with curing head, conveyor, exhaust system and vacuum holddown.
 
www.awt-gpi.com

Daat Research Corporation introduces CoolitPCB v4.0, the cost-effective, easy-to-use CFD software that provides a thermal modeling option. PCB designers can perform board level analysis; predict thermal behavior of designs and pinpoint optimum component placement on boards.
 
The software allows designers to construct models of Ball Grid Arrays, Dual Inline Packages and Quad Flat Packages in detail. They can also select, modify and save IC packages from the extensive IC Package Library, saving the results. The models can be converted into compact models, allowing for rapid computation and saving valuable time.
 

Cadence Design Systems, Inc. and ARM have collaborated on a hardware/software co-verification environment, the Cadence Incisive Palladium III that speeds up the system validation process to create a faster path to first silicon working with early software.
 
The acceleration/emulation system will be for advanced processor development. It will be used for in-circuit emulation, as well as transaction-based acceleration. Multimedia, graphics and network storage applications will be the focus, allowing customers to expand and accelerate their system validation ramp-up in these markets.
 
Based on a reference design utilizing the Palladium III system, ARM RealView Debugger, ARM processor IP and Cadence SpeedBridge adapters can demonstrates audio/video playback and capture of AVI and MP3 files, as well as Web browsing, software debugging and Linux boot. Using the collaborative environment, customers are able to ramp-up the ARM processor-based design system validation environments quickly.
 
 
www.cadence.com
www.armcorp.com

Linear Technology Corporation introduces the LT3085, part of the next generation of NPN LDOs. It has a 500 mA output current and offers input voltage capabilities from 1.2 V to 36 V. The output voltage is adjustable, ranging from 0 V to 35 V, while the dropout voltage is only 275 mV at full load. The outputs can also be paralleled for a higher output current or for easier heat spreading. 
 
It is stable with ceramic, aluminum and Tantalum Capacitors and comes in two high power density packages; a thermally enhanced, 8-lead MSOP and a low profile, 6-lead DFN. Both packages can dissipate 1 W to 2 W in surface mount applications without requiring a heat sink. Safety features include thermal limiting and current limiting with foldback.
 
www.linear.com