The NanoBond bonding material manufactured by Reactive NanoTechnologies, Inc. (RNT) has exceeded testing through 1000 thermal cycles with no degradation in thermal performance or bond strength.

The product was tested at -40ºC to +110ºC, per IEC 62108, Test 10.6. Testing at 110ºC typically concludes at 500 cycles, but the testing was continued through 1000 cycles. Thermal conductivity was measured by laser flash technique.

NanoBond is used to bond microelectronic and photovoltaic components to PCBs or heat sinks at room temperature.

www.rntfoil.com

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