The PicoStar package from Texas Instruments uses up to 80% less board space. According to TI this ultra-thin package is the first to give system designers the option to embed silicon components inside the PCB to decrease the board space used for EDS protection.
The TPD2E007 is a two-channel electrostatic discharge (ESD) solution with a back-to-back diode array that allows AC-coupled data transmission without compromising signal integrity. Designers have the option to surface mount or embed the TPD2E007 into the board/connector for ESD protection. The ability to embed this device can save up to 80% board space compared to typical ESD solutions.