Products

Rogers Corporation introduces dur-E-volt LED driver, a constant-frequency, peak current mode control LED driver. The product allows an LED string to be driven at a fixed current, separate from the supply voltage. This provides improved reliability and constant light output. The dur-E-volt LED driver is able to support anywhere from one to hundreds of LEDs in series or parallel combinations, using fewer components. It is compact in size and is reported to be 90% efficient and to have excellent heat dissipation. High brightness LEDs (HBLEDs) from 8 VDC to 450 VDC can be supported efficiently. LED dimming can be controlled by two methods: by the PWM input pin or by adjusting the voltage to the LD/Linear Dimming pin. The driver is RoHS and WEEE complaint.
 
www.rogerscorp.com/durel
3M introduces Series 95X, smaller form factor board-to-board stacking connectors and box headers. This series provides a lower cost, 10 microinch (or µin.), gold thickness for high-volume applications that have a less stringent demand on the number of mating cycles. These low cost connectors are suited for short service life applications that will not face extreme temperatures or hostile atmosphere. The headers and connectors are IEC Performance Class 3 qualified and meet the EU and China RoHS legislations. They can satisfy numerous applications, including consumer electronics, control units for industry and handheld test and measurement devices.
 
www.3M.com
Agilent Technologies Inc. introduces the Transient-Convolution Simulator, able to achieve a three-fold simulation speed improvement for signal integrity simulations. It is reported to be the fastest signal integrity circuit simulator for multigigabit, high-speed data link design. Signal integrity designers can perform quick analyses with the high-capacity sparse matrix solver, and simulation times have been reported to be cut in half. Part of Agilent’s Advanced Design System (ADS) EDA software platform, applications include both design and verification of chip-to-chip multigigabit serial links.
 
www.agilent.com
Vishay Intertechnology Inc. introduces MKP 339 X2, MKP 338 2 X2 and MKP 336 2 X2, X2 electromagnetic interference (EMI) suppression film capacitors. They have a maximum voltage of 310 Vac as well as a large range of lead pitches and capacitance values. According to Vishay, the increased voltage rating still meets safety approvals, and the capacitor maintain the same compact dimensions. Lead pitches range from 7.5 mm to 27.5 mm, and capacitance values range from 1 nF to 4.7 μF. The capacitors are optimized for standard across numerous applications including power supplies, EMI filters and white goods. They are lead-free and RoHS compliant, with tinned wire leads.
 
www.vishay.com

Murata Electronics North America introduces MAGICSTRAP, an advanced Radio Frequency Identification (RFID) Tag that can be attached onto a PCB. It is inductively coupled to the antenna that is integrated into the PCB. Because no electrical contact is needed, MAGICSTRAP adheres directly to the PCB using glue or sticky tape. The circuitry allows for the impedance matching feature, needed to cover the total UHF bandwidth while complying with the EPCGlobal C1 G2 standard. It features high tolerance against Electro Static Discharge over 10kV and measures only 3.2mm by 1.6mm.

 

www.murata.com

Applied Nanotech Holdings introduces CarbAl, a carbon-based metal nanocomposite heat sink material. Reported to be three times more effective at diffusing heat, the material is comprised of 20% aluminum and 80% carbonaceous matrix, and it has a thermal transmission near 500 W/mK. The material is lighter than the traditional metallic heat sinks and provides low-cost, high-quality heat sinks for the microelectronic industry.
 
www.appliednanotech.net

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