Printed Circuit Design & Fab Online Magazine - Current

Products

Agilent Technologies Inc. introduces Electromagnetic Professional (EMPro), a design platform for analyzing electromagnetic (EM) effects on RF and microwave components. The software features a modern design, simulation and analysis environment.

Design entry through the 3D drawing environment, importing of 3D CAD data files and integration with ADS allow for efficient and time-saving designs. It is capable of integration with Agilent’s Advanced Design System, providing quick and efficient RF and microwave circuit design. Also, it is reported to lessen the time designers spend in set up, simulation and post processing.

Additional features include real-time plot updating during simulation, parameterization of 3D objects and one-time materials assignment. The software has interactive 3D editing that reduces excessive mouse movement, as well as Linux and Windows support.

www.agilent.com

Florida CirTech Inc has developed CK300-Catalyst Killer. The product is an acidic liquid concentrate that is a highly concentrated. Developed to clean printed circuits before the Electroless Nickel Immersion Gold (ENIG) process, CK300 is reported to remove palladium catalyst residues and other surface contaminates.

CK300 contains sulfuric acid and fluorides, but no alkyl phenol type surfactants. It also eliminates ENIG plating in non-plated through holes.

www.floridacirtech.com

Valor Computerized Systems introduces manufacturing dashboards that allow customers to monitor manufacturing operations in real time. Using Integrating Business Objects’ technology, the dashboards provide accurate and quick data interpretation from the company’s manufacturing and test operations.

The dashboards have numerous adjustable templates that display specific Key Performance Indicators (KPIs). This provides important visibility for each operational environment, identifying trends or patterns for corrective action.

Customers can obtain work order status, analytical results and line/machine performance real-time information, as well as OEE measurements and nozzle/feeders errors for specific ID numbers. The dashboards give performance views for multiple assembly lines, WIP tracking and full metrics of KPIs for factory performance. Valor reports the dashboards are ready to use right out of the box, but customization is still available.

www.valor.com

Cymbet Corporation introduces EnerChip CC CBC3112 and CBC3150, thin-film batteries with integrated battery management. The single surface mount technology (SMT) package combines several power system features, including thin-film battery, supply supervisor and low-ripple chargers.

The CBC3112 is a 12-micron Ah device and the CBC3150 is a 50-micron Ah device. Both are packaged in 7 mm by 7 mm, or 9 mm by 9 mm DFN surface mount, reflow tolerant packages.

Additional features include: >5000 recharge cycles, stable output voltage and does not need a socket or holder. Cost-effective and having numerous applications, Cymbet believes the combination of integrated battery management and thin-film technology will “save board space” and “reduce assembly costs.”

www.cymbet.com

W.L. Gore & Associates, Inc. introduces GORE QSFP, copper cable assemblies for high-performance computing (HPC), enterprise network and network storage markets. It is reported that signal reliability is improved at speeds over the standard InfiniBand QDR data rate of 10 Gbps/channel.

Benefits include low latency, decreased jitter and maximum signal eye opening. Signal reliability is enhanced over the InfiniBand QDR data rate of 10 Gbps/channel. The cable is constructed with low dielectric materials that improve bend radius over longer distances in small cross-sectional areas.

The assemblies are offered with GORE EYE-OPENER Conductor technology for higher data rate and longer distances. According to the company, the cables are designed to “reach further than other cables” and will lighten cable management in tight spaces because of their smaller size.

www.gore.com

Silicon Laboratories, Inc. introduces the Si474x automotive AM/FM radio receiver IC. Reported to be the smallest and most fully integrated, the receiver supports worldwide radio band requirements, including weather bands, short wave and long wave. External component count and the associated costs have been reduced 40%, according to reports.

With a printed circuit board (PCB) footprint less than 4 cm, the single-chip solution is packaged in a 4 mm by 4 mm package. It consumes less than 1/10^th the power of standard tuner ICs, and automotive-grade quality is provided.

The product can support integrated algorithms, impulse noise event detection and blanking and advanced audio behavior in adverse radio environments. The features are programmable and can be customized for manufacturer and model specifications.

www.silabs.com