Molex Inc., in conjunction with Neoconix, introduces the Molex FlexBeam Tool-Less Copper Flex Interposer. The high-speed, copper flex assembly from Molex joins Neoconix’s HD&S PCBeam interposer to provide high-density interface for flex-to-PCBA applications.
 
The product is a low profile, flex-to-board interface providing densities of 1.00 mm or less in numerous pin-matrix configurations. A z-axis is added to traditional 2D PCB processing through all-metal spring beams permanently embedded onto an FR-4 substrate.
 
With photolithography and etch-based processes, the interposer provides dimensional control that is scalable to very fine feature sizes for applications having space constraints. The integrated copper flex assembly enables signal speeds greater than 10 Gbps and single-ended speed of 4 GHz and higher.
 
Users can achieve board-to-flex pin counts of 500 input/outputs or greater, and a dual-beam option is available for contact redundancy in high-reliability applications. 
 
www.molex.com 
 
 
 
 

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