Printed Circuit Design & Fab Online Magazine - Current

Products

IRphotonics introduces the iCure AS200, an inline fiber optic system that provides thermal spot curing. The portable unit offers infrared radiation that is easily and quickly absorbed by thermal epoxies, resulting in faster and stronger curing. In addition, a light guide allows for precise and localized heating of bonded assemblies, and the automated manufacturing process eliminates the need for multiple thermal ovens, thus reducing costs.

www.irphotonics.com

GOEPEL electronic introduces CION Module/DIMM240, a digital low-cost module that allows for the testing of signal and voltage supply pins of JEDEC Std. Compliant DIMM240 sockets for DDR2-SDRAM. The module can be plugged into a respective socket, enabling the interface stages’ voltages to be adapted automatically. In addition, the module comes with a transparent TAP that allows several boards of the same or differing types to be cascaded in a Daisy Chain configuration. Additional features include safety mechanisms that prevent damage in case of shorts, extended power yield and voltage programmable TAP, and the module is supported by all JTAG/Boundary Scan controllers from the ScanBooster and SCANFLEX families.

www.goepel.com

Integrated Module Board technology permits smaller boards through adaptations to existing manufacturing processes. Components are embedded inside the core layer of the PCB, while being electrically connected directly to the conductors on top of the core layer. Can embed many types of components, including passives, bare die and wafer-level CSPs. Combines PCB manufacturing, component packaging and component assembly into one manufacturing sequence. Can be used to embed components inside a module substrate and manufacture a multi-chip-module / System-In-Package (SIP) product. Can be used to embed components inside a motherboard to manufacture a System-In-Board (SIB) product.

Imbera Electronics, http://www.imbera.fi

Mentor Graphics’ ECAD-MCAD Collaborator product enables bidirectional, digital communication of incremental design changes and automates the review and approval processes from design inception to manufacturing. Based on ProSTEP iViP Association-approved electromechanical interchange standard and developed in collaboration with PTC. Works in the Expedition Enterprise and Board Station XE PCB design flows, and PTC’s Pro/ENGINEER Wildfire 4.0 ECAD-MCAD Collaboration Extension.

Mentor Graphics, www.mentor.com

Rogers Corporation introduces RO3000 and RO4000 laminates that are antenna-grade, high-frequency circuit materials, featuring low passive intermodulation, low loss and higher thermal conductivity for improved power-handling capability. The RO3000 series is a PTFE-based circuit material that combines lower loss and minimal variation in dielectric constant and can be used in applications through 40 GHz. RO4000 laminates are glass-reinforced hydrocarbon/ceramic laminates that are reported to provide superior dimensional stability and tight dielectric-constant tolerance across the panel.

www.rogerscorporation.com

Agilent Technologies Inc. introduced SystemVue 2008, an electronic design automation (EDA) platform for electronic system-level (ESL) design. The platform is reported to reduce physical layer (PHY) design time by half for high-performance communications algorithms and system architectures for not only wireless, but also aerospace/defense applications. SystemVue offers an easy-to-use environment with links to hardware implementation and tests, as well as complements existing EDA tools used in FPGAs, DSPs and ASICs and Analog/RF components.

www.agilent.com