Enthone has introduced an organic metal-based nanofinish, OrmeSTAR Ultra final finish. According to the company the process consumes approximately 90% less energy, reduces process time by 75% and lowers cost by 30% compared to an electroless nickel / immersion gold (ENIG) process.

Features include a surface conductivity comparable to pure gold and signal transmission that outperforms ENIG finishes. The solder bonds directly to copper to form strong solder joints. The durable coating allows for wipe downs on misprinted assemblies with no copper oxidation. Hold time between thermal cycles is similar to other metal finishes.

The nanofinish generates a visible coating that allows for ease of inspection and high first-pass yields with no false failures at in-circuit test. Application during PCB fabrication can occur before electrical test.

OrmeSTAR Ultra bonds with copper without a displacement reaction, increasing bath life. Low application temperatures, minimal water usage and long bath life make OrmeSTAR Ultra an environmentally friendly HASL alternative.

www.enthone.com

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