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  • Thermal Vias are Ineffective. Here’s Why.

    Thermal Vias are Ineffective. Here’s Why.

    Adding thermal vias can take up valuable board space with little benefit.
      READ MORE...

  • Connecting the Industry, from Boards to Assemblies

    Connecting the Industry, from Boards to Assemblies

    HDP is embarking on new rounds of evaluations of laminates and lead-free solders.
      READ MORE...

  • Exploring the Impact of AI

    Exploring the Impact of AI

    A special panel discusses the growth of AI tools and its possible effects on the industry.
      READ MORE...

  • A Journey in Rigid-Flex Design

    A Journey in Rigid-Flex Design

    Overcoming the challenges of rigid-flex designs can be incredibly rewarding.
      READ MORE...

  • Creating the Ultra Library

    Creating the Ultra Library

    Building and maintaining what's said to be the world's largest CAD database requires strong relationships.
      READ MORE...

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2010 Magazine Archives

March 2010 Issue

Published: 01 March 2010
 by Administrator

PCD&F March 2010 cover

FEATURES

  • Impedance Control
    Accurate Impedance Control, Part II
    Choosing the right method for determining impedance control of multi-GHz or multi-Gb boards.
    by Istvan Nagy

  • Signal Integrity
    Designing PCBs with High-Speed Constraints
    SI rules must take into account signal quality, timing and crosstalk.
    by Patrick Carrier

  • Cover Story
    Could Printed Electronics Replace Traditional Electronics?
    Over the next 10 years, printed electronics will make gains in RFID, displays, packaging, ICs, and alternative energy. But a glorious future isn't set in stone.
    by Randall Sherman

  • CIRCUITS ASSEMBLY Top 50
    The Trials of 2009
    When it comes time to write the story of the EMS industry in 2009, foremost will be the effects of the recession. The subtext, however, will be the dramatic fall of Elcoteq, whose final chapter is still being written. Plus: The 50 largest EMS companies.
    by Mike Buetow

FIRST PERSON

  • Caveat Lector
    Tin drums beat louder.
    Mike Buetow

  • Database
    Scary thoughts on DfM.
    Pete Waddell

MONEY MATTERS

  • Global Sourcing
    Getting vertical.
    Rex Green

  • ROI
    Merger mania strikes again.
    Peter Bigelow

TECH TALK

  • Designer's Notebook
    Defining PDN impedance.
    Dr. Zhen Mu

  • On the Forefront
    Can Japan stay committed to R&D?
    E. Jan Vardaman

  • Tech Tips
    Component reliability for RF applications.
    ACI Technologies Inc.

  • Solar Technologies
    Frontside silver conductor line efficiency.
    Tom Falcon

 

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