Co-Design Electronic System Design ECAD-MCAD collaboration supports bidirectional communication that can shorten design times, reduce errors and bring competitive products to market faster. by John Isaac
Design Basics Data Management 101 When data management is an integral part of the design environment, it works with designers rather than against them. by Rob Evans
Salary Survey Designers Take on Technology challenges in 2008 The decisions made in the design seat determine not only the size and shape of the PCB, but also the technology and materials needed to build it. by Kathy Nargi-Toth
System Design PCB Signal Integrity, Power Integrity and EMC Challenges System-level PCB emission analysis reduces re-spins and EMC issues when PCBs are incorporated into larger systems. by Brad Brim
Regulation Update What’s in a Name? The roles WEEE, RoHS and REACH play in the environment. by Margo Lakin
HS Laminates PCB Dielectric Materials for High-Speed Applications The glass weave in a laminate can affect propagation velocity and loss profile, leading to signal loss and skew in differential pairs. by Ravindra Gali
POINT OF VIEW
Our Line Narrowing the gap. Kathy Nargi-Toth
ROI Providing great customer service can bring success in tough economic times. Peter Bigelow
Global Sourcing A proposed QMl will cost OEMs and suppliers more – and won’t solve the target problem. Greg Papandrew
EMC for the Real World Knowing the ins and outs of EMC software tools can save time and money. Dr. Bruce Archambeault
Interconnect Strategies Stackup analysis can help to optimize layer count, trace width, spacing and electrical performance. Dr. Abe (Abbas) Riazi
On the Forefront In the area of basic research, who will play? And who will pay? E. Jan Vardaman
Final Finish Forum ENEPIG is a unique surface finish that exhibits improved solder joint reliability when it is used with lead-free SAC alloys. George Milad
Test and Inspection How a grassroots organization can help get managers on board. Stacy Kalisz Johnson
BGA Bulletin Fine-pitch BGAs dramatically increase in pin count and will drive adoption of HDI. Charles Pfeil
DfM Basics Ten Tips to Improve Manufacturability It’s as simple as doing it right the first time. by Arbel Nissan
System Modeling 3D Chip-Package-Board Modeling Advanced computing languages will help to develop flexible solver architectures and efficient simulation methods. by Vikram Jandhyala, Dipanjan Gope, Swagato Chakraborty, Feng Ling, Xiren Wang, Devan Williams And James Pingenot
Measurement and Simulation Improving Circuit Simulation With The Addition Of Real Measurements Real measurements allow the engineer to proactively improve the design, saving time and money. by Bhavesh Mistry
From the Field PCB West: Interview with NBS Design Inc. Craig Arcuri talks about the company credo – passion, quality and speed – which translates into end product perfection. by Kathy Nargi-Toth
Lead-Free Reliability The Influence of Final Finish on Lead-Free Assembly Reliability Understanding the end use application of a PCB is critical in the selection of right solderable final finish for Pb-free applications. by Mohammad Hossain, Nikhil Lakhkar, Puligandla Viswanadham and Dereje Agonafer
Solder Resists The Lead-free Soldering Challenges for Peelable Resists The appeal of peelable resist technology. by Ian McDonald
POINT OF VIEW
Our Line Improving the bottom line. Kathy Nargi-Toth
ROI Tough times call for cooperation across the supply chain. Peter Bigelow
Positive Plating Anode-cathode placement and secondary current distribution. Michael Carano
BGA Bulletin Any-layer vias can be stacked to span any set of layers. Charles Pfeil
