DIFFERENTIAL PAIRS Why You Should Care About Mode Conversion Those familiar with designing high-speed single-ended interconnects don’t have a huge leap to design high-speed differential pairs. But a new problem can arise in differential pairs that has no comparable effect in single-ended interconnects, one that can completely swamp the differential signal at the receiver and can make the difference between a robust product and one that works with boards from some vendors but not others. by Dr. Eric Bogatin
DfM Best Practices for SMT Design Fine-pitch devices and automation levels are resulting in greater board density. There are mechanical and logistical limits to how far these trends can go, however, and proper procedures will ensure manufacturability. by George Henning
RETROSPECTIVE In Memoriam A look back at friends and colleagues who left us in 2010. by Mike Buetow
SMTAI RECAP Good Times in Orlando In the technical sessions and on the show floor, SMTAI was a success. by Mike Buetow
SIGNAL INTEGRITY Generalized I/O Timing Analysis, Part 2 Timing analysis is a complex engineering process. It requires the engineer to deal with logic design, signal integrity simulations, PCB and chip design timing parameters, and generate length/delay constraints for chip/package/PCB designs. This, the second of a two-part series, looks at how timing and PCB trace lengths affect different real systems, and design tricks for tuning timing. by Istvan Nagy
PCB WEST RECAP Hot in the Valley Something isn’t getting through, as signal integrity classes were packed even though most designers say they don’t perform the critical analysis. by Mike Buetow
COVER STORY PCB Thermal Design Developments Heat coupling increases as components and PCBs become smaller and more powerful. Designers must take remedial action to bring all components within their respective thermal specifications, but this step is becoming more challenging and constrained, even when preventative measures are taken early in the design process. New 3D thermal quantities can help address thermal problems as they arise. by Byron Blackmore, John Parry and Robin Bornoff
FIRST PERSON
Caveat Lector Tough choices call for single voice. Mike Buetow
MONEY MATTERS
ROI Our new stability. Peter Bigelow
TECH TALK
On the Forefront Flex’s new twists. E. Jan Vardaman
Signal Doctor Measuring differential pair loss. Dr. Eric Bogatin
Generalized I/O Timing Analysis SI/timing analysis can be performed heuristically, but there is a systematic approach as well. Timing analysis can be performed to create PCB layout design trace length constraints (pre-layout analysis), to determine the maximum data rate where the interface is still reliably operational (pre- or post-layout), and to verify an already routed board (post-layout analysis) would work reliably. by Istvan Nagy
Team Design No Reassembly Required Introducing parallelism into the design process shortens, accelerates or recovers our schedules. The approaches to concurrent engineering. by Jamie Metcalfe
Perfect Paperwork Best Practices for Preparing Documentation Electronics assembly documentation includes files such as design schematics, assembly drawings, test procedures, BoMs and more. Problems or omissions in this documentation result in delays and, in extreme cases, may lead to product deficiencies and quality issues. How to ensure documentation for the EMS company is accurate. by George Henning
FIRST PERSON
Caveat Lector Still like Ike? Mike Buetow
Talking Heads Altium’s Alan Smith. Mike Buetow and Chelsey Drysdale
MONEY MATTERS
Global Sourcing What DoD cuts mean for the US PCB industry. Matthew Holzmann
ROI Do customers know what they want? Peter Bigelow
Documentation Automating the Documentation Process “Documentation is much bigger than just design, fab and assembly,” experts say. A look at best-in-class processes that reduce the amount of time spent on drawings and notes by creating a “living” document. by Mike Buetow
DfM Best Practices for Double-Sided Mixed-Technology Boards Plated through-hole assembly remains in use for some heavy power connectors, transformers and other devices where strong mechanical bonds are required. Reason: Heavy parts are prone to falling off during soldering. by George Henning
Material Management Benefits of Factory Software Interoperability Manufacturers deploy various manufacturing systems that provide necessary controls, enable data collection, support cost-saving initiatives, provide a means for compliance, and help decrease time to market. Yet most remain as islands of information, and provide the value intrinsic within their own confined systems. Can overall equipment effectiveness be optimized by enhancing links between material flow, quality and surface mount technology programming, and monitoring data? by Jay Gorajia
FIRST PERSON
Caveat Lector Use proper protection. Mike Buetow
Database Not a standard opinion. Pete Waddell
MONEY MATTERS
ROI Certifiable. Peter Bigelow
Focus on Business Why one size doesn’t fit all. Susan Mucha
TECH TALK
Signal Doctor Ten electrical design lessons. Dr. Eric Bogatin
Designer's Notebook DfM, properly applied. Max Clark
Process Improvement The DfM Continuum Design and manufacturing often are thought of as separate processes, with some interdependencies. But absent a feedback loop, development will be marred by unnecessary defects and re-spins. by John Isaac and Bruce Isbell
Signal Integrity Open 'Eyes' in the Frequency Domain Although final performance is measured in the time domain, a detour may be the faster route to a signal integrity solution. by Dr. Eric Bogatin
Materials Engineering Heat Transfer in LED Assembly LEDs may seem cool to the touch, but they all produce heat. So while they offer significant benefits over filament and fluorescent lighting, dissipating heat within an LED assembly involves the selection and use of thermally conductive and (usually) electrically insulating materials. by Chuck Neve
FIRST PERSON
Caveat Lector Toyota's painful lesson. Mike Buetow
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