May 2008 PCD&F Cover


Signal Integrity
Don’t Let Your Signals Stub Their Toes
Tame the stubs by keeping the length short, restricting signal layer transitions, and using back-drilling in multigigabit applications.
by Dr. Eric Bogatin

PCB Basics
Improve PCB Layout With Skill Utility Programs
PCB design bottlenecks are reduced using customized tools.
by Arbel Nissan

From the Field
The Next Generation Design Tool Challenge
An interview with Henry Potts of Mentor Graphics.
by Kathy Nargi-Toth

Thermally Conductive Microwave Materials
Increasing the thermal conductivity of the base materials improves thermal management in RF designs.
by Russ Hornung, Mike Smith and Chet Guiles

Lead-Free Reliability
PCB Dielectric Degradation in Lead-Free Assembly Applications
Reliable lead-free assemblies require a collaborative approach that optimizes the PCB design along with specific base materials and known fabrication processes.
by Paul Reid

CPCA/IPC Expo Review
A Tale of Two Trade Shows
Can 75,000 people in one place be environmentally friendly?
by Kathy Nargi-Toth

Quality Control
Eliminating Board Defects
The assembly drawing should specify process-related issues.
by Zulki Khan


Our Line
Trusted sources.
Kathy Nargi-Toth

Now more than ever, the need for quality initiatives and continuous improvement move to the forefront of good business management practices.
Peter Bigelow

EMC for the Real World
A closed loop creates inductance, so control your signal path by minimizing
the loop area.
Dr. Bruce Archambeault

Positive Plating
Electroplating difficulty is measured by board thickness, hole diameter and aspect ratio.
Michael Carano

BGA Bulletin
Aligning blind via fanout patterns can significantly increase route density.
Note: This column ran in four parts in the March, April, May and June issues. All four parts are included here.
Charles Pfeil


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