FEATURES

DfM Basics
Ten Tips to Improve Manufacturability
It’s as simple as doing it right the first time.
by Arbel Nissan

System Modeling
3D Chip-Package-Board Modeling
Advanced computing languages will help to develop flexible solver architectures and efficient simulation methods.
by Vikram Jandhyala, Dipanjan Gope, Swagato Chakraborty, Feng Ling, Xiren Wang, Devan Williams And James Pingenot

Measurement and Simulation
Improving Circuit Simulation With The Addition Of Real Measurements
Real measurements allow the engineer to proactively improve the design, saving time and money.
by Bhavesh Mistry

From the Field
PCB West: Interview with NBS Design Inc.
Craig Arcuri talks about the company credo – passion, quality and speed – which translates into end product perfection.
by Kathy Nargi-Toth

Lead-Free Reliability
The Influence of Final Finish on Lead-Free Assembly Reliability
Understanding the end use application of a PCB is critical in the selection of right solderable final finish for Pb-free applications.
by Mohammad Hossain, Nikhil Lakhkar, Puligandla Viswanadham and Dereje Agonafer

Solder Resists
The Lead-free Soldering Challenges for Peelable Resists
The appeal of peelable resist technology.
by Ian McDonald

POINT OF VIEW

Our Line
Improving the bottom line.
Kathy Nargi-Toth

ROI
Tough times call for cooperation across the supply chain.
Peter Bigelow

Positive Plating
Anode-cathode placement and secondary current distribution.
Michael Carano

BGA Bulletin
Any-layer vias can be stacked to span any set of layers.
Charles Pfeil

DEPARTMENTS

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