Electronic System Design
ECAD-MCAD collaboration supports bidirectional communication that can shorten design times, reduce errors and bring competitive products to market faster.
by John Isaac
Data Management 101
When data management is an integral part of the design environment, it works with designers rather than against them.
by Rob Evans
Designers Take on Technology challenges in 2008
The decisions made in the design seat determine not only the size and shape of the PCB, but also the technology and materials needed to build it.
by Kathy Nargi-Toth
PCB Signal Integrity, Power Integrity and EMC Challenges
System-level PCB emission analysis reduces re-spins and EMC issues when PCBs are incorporated into larger systems.
by Brad Brim
What’s in a Name?
The roles WEEE, RoHS and REACH play in the environment.
by Margo Lakin
PCB Dielectric Materials for High-Speed Applications
The glass weave in a laminate can affect propagation velocity and loss profile, leading to signal loss and skew in differential pairs.
by Ravindra Gali
Narrowing the gap.
Providing great customer service can bring success in tough economic times.
A proposed QMl will cost OEMs and suppliers more – and won’t solve the target problem.
EMC for the Real World
Knowing the ins and outs of EMC software tools can save time and money.
Dr. Bruce Archambeault
Stackup analysis can help to optimize layer count, trace width, spacing and electrical performance.
Dr. Abe (Abbas) Riazi
On the Forefront
In the area of basic research, who will play? And who will pay?
E. Jan Vardaman
Final Finish Forum
ENEPIG is a unique surface finish that exhibits improved solder joint reliability when it is used with lead-free SAC alloys.
Test and Inspection
How a grassroots organization can help get managers on board.
Stacy Kalisz Johnson
Fine-pitch BGAs dramatically increase in pin count and will drive adoption of HDI.
Interactive Ad Index
Off the Shelf