Applied Nanotech Holdings introduces CarbAl, a carbon-based metal nanocomposite heat sink material. Reported to be three times more effective at diffusing heat, the material is comprised of 20% aluminum and 80% carbonaceous matrix, and it has a thermal transmission near 500 W/mK. The material is lighter than the traditional metallic heat sinks and provides low-cost, high-quality heat sinks for the microelectronic industry.
 
www.appliednanotech.net

IRphotonics introduces the iCure AS200, an inline fiber optic system that provides thermal spot curing. The portable unit offers infrared radiation that is easily and quickly absorbed by thermal epoxies, resulting in faster and stronger curing. In addition, a light guide allows for precise and localized heating of bonded assemblies, and the automated manufacturing process eliminates the need for multiple thermal ovens, thus reducing costs.
 
www.irphotonics.com

GOEPEL electronic introduces CION Module/DIMM240, a digital low-cost module that allows for the testing of signal and voltage supply pins of JEDEC Std. Compliant DIMM240 sockets for DDR2-SDRAM. The module can be plugged into a respective socket, enabling the interface stages’ voltages to be adapted automatically. In addition, the module comes with a transparent TAP that allows several boards of the same or differing types to be cascaded in a Daisy Chain configuration. Additional features include safety mechanisms that prevent damage in case of shorts, extended power yield and voltage programmable TAP, and the module is supported by all JTAG/Boundary Scan controllers from the ScanBooster and SCANFLEX families.
 
www.goepel.com