GIGABYTE announced that many of its upcoming motherboards will feature Ultra Durable 3. The company claims this is the first technology to use 2 oz. copper layers for the power and ground layers. The results should be creative heat spreading, resulting in lower system temperatures, up to 50 °C in some areas according to GIGABYTE. Increased efficiency, decreased chances of warping and greater headroom for over locking are also claimed. Integrated Japanese capacitors provide 50,000 hours of use.

 

www.GIGABYTE.com

Rogers Corporation introduces dur-E-volt LED driver, a constant-frequency, peak current mode control LED driver. The product allows an LED string to be driven at a fixed current, separate from the supply voltage. This provides improved reliability and constant light output. The dur-E-volt LED driver is able to support anywhere from one to hundreds of LEDs in series or parallel combinations, using fewer components. It is compact in size and is reported to be 90% efficient and to have excellent heat dissipation. High brightness LEDs (HBLEDs) from 8 VDC to 450 VDC can be supported efficiently. LED dimming can be controlled by two methods: by the PWM input pin or by adjusting the voltage to the LD/Linear Dimming pin. The driver is RoHS and WEEE complaint.
 
www.rogerscorp.com/durel

3M introduces Series 95X, smaller form factor board-to-board stacking connectors and box headers. This series provides a lower cost, 10 microinch (or µin.), gold thickness for high-volume applications that have a less stringent demand on the number of mating cycles. These low cost connectors are suited for short service life applications that will not face extreme temperatures or hostile atmosphere. The headers and connectors are IEC Performance Class 3 qualified and meet the EU and China RoHS legislations. They can satisfy numerous applications, including consumer electronics, control units for industry and handheld test and measurement devices.
 
www.3M.com

Agilent Technologies Inc. introduces the Transient-Convolution Simulator, able to achieve a three-fold simulation speed improvement for signal integrity simulations. It is reported to be the fastest signal integrity circuit simulator for multigigabit, high-speed data link design. Signal integrity designers can perform quick analyses with the high-capacity sparse matrix solver, and simulation times have been reported to be cut in half. Part of Agilent’s Advanced Design System (ADS) EDA software platform, applications include both design and verification of chip-to-chip multigigabit serial links.
 
www.agilent.com