Matrix Metrologies, Inc. introduces the Benchtop XRF. The XRF tools offer compliance testing and monitoring for circuit board and packaging electronics, as well as plating industries. The system performs nondestructive measurements of RoHS and WEEE prohibitive metals: lead, mercury, chromium, bromine and cadmium.
 
The system can also perform lead content quantification for military and aerospace demands that require 2% to 5% minimum lead content. Tool audit and measurement integrity management is offered through certified reference standards. Standard circuit and packaging applications can be measured, including Au/Ni/Cu and gold electro less nickel stacks.
 
XRF spectrometers are capable of being configured with gas-proportional, Si-PIN or silicon-drift type detectors and primary beam filtration for quick, non-destructive RoHS lead-free verification. Lead sensitivity and measurement confidence is provided at the 1000-ppm action level.
 
www.matrixmetrologies.com

A.W.T. World Trade Inc. introduces Accu-Cure UV, curing units designed for high-speed curing of PCBs, as well as other flat and rigid panel substrates. The cooling system lowers heat transmission levels, protecting the substrate and belt.
 
Features include a repositionable curing head with a focused reflector and a gate height adjustment that can accommodate substrates of various thicknesses. Users can choose UV output from the variable position wattage selections: 100-, 200-, 300- or 400-watts per inch.
 
Light guards protect from UV and visible band light; the ozone removal system removes hot air and ozone from the work area. During rapid curing, substrates are protected and positioned by the vacuum holddown system. The unit is reported to be very quiet.
 
Curing widths are available from 12 in. to 100 in., and conveyor lengths start at 5 ft. The units can be single or double lamped and have Gallium lamp or 400W upgrades available. Quartz polished glass, a recessed parts conveyor and additional sections by the foot are offered. 
 
The unit is available in several configurations, including a vacuum holddown retro-fit package, curing head with light guard assembly and a complete UV curing system with curing head, conveyor, exhaust system and vacuum holddown.
 
www.awt-gpi.com

Daat Research Corporation introduces CoolitPCB v4.0, the cost-effective, easy-to-use CFD software that provides a thermal modeling option. PCB designers can perform board level analysis; predict thermal behavior of designs and pinpoint optimum component placement on boards.
 
The software allows designers to construct models of Ball Grid Arrays, Dual Inline Packages and Quad Flat Packages in detail. They can also select, modify and save IC packages from the extensive IC Package Library, saving the results. The models can be converted into compact models, allowing for rapid computation and saving valuable time.
 

Cadence Design Systems, Inc. and ARM have collaborated on a hardware/software co-verification environment, the Cadence Incisive Palladium III that speeds up the system validation process to create a faster path to first silicon working with early software.
 
The acceleration/emulation system will be for advanced processor development. It will be used for in-circuit emulation, as well as transaction-based acceleration. Multimedia, graphics and network storage applications will be the focus, allowing customers to expand and accelerate their system validation ramp-up in these markets.
 
Based on a reference design utilizing the Palladium III system, ARM RealView Debugger, ARM processor IP and Cadence SpeedBridge adapters can demonstrates audio/video playback and capture of AVI and MP3 files, as well as Web browsing, software debugging and Linux boot. Using the collaborative environment, customers are able to ramp-up the ARM processor-based design system validation environments quickly.
 
 
www.cadence.com
www.armcorp.com