ERNI Electronics presents the Blind-mate MicroSpeed connector. Designed for mezzanine card applications, the connector is a 1.0-mm pitch system that employs SMT technology for data rates up to 10 Gbit/s.
 
It is offered in 50 signal contact modules and can be used in multiples between two parallel cards without mating issues. Smaller connections can be used to shorten PCB traces, reduce PCB layers and improve system airflow.
 
The open pin field design includes two rows of 50 signal contacts with perimeter shielding, suitable for differential and single-ended requirements. Available in the standard 1 mm and 4 mm heights, additional heights are planned.
 
www.erni.com

CircuitMedic introduces Flextac Wire Dots, a wire tacking system. It is comprised of shapes precut from flexible, polymer film membrane that has been coated on one side with a high-pressure and electronics-grade adhesive.
 
The adhesive performance is not affected by high humidity. Bond strengths are reported to be higher after exposure for 7 days at 90° F and 90% relative humidity. Many chemicals, including flux-cleaning solutions, saponifiers, mild acids and alkalis, do not affect the bond.
 
Wires will hold through a PCB hot water wash;  Flextac Wire Dots achieve the best performance at temperatures ranging between 60° F and 100° F.

www.circuitmedic.com

Chomerics introduces Soft-Shield 4850, an EMI shielding gasket. The gasket is reported to deliver shielding effectiveness between 70 dB and 80 dB by using multi-planar Z-axis conductive foam.
 
UL 94 V-O certified, the material provides shielding in consumer and commercial electronics, telecom and information technology applications. The material comes in precut strips and in a range of widths.
 
Costs are reduced by the use of electrically conductive silver plated fibers optimally dispersed in low-density foam. It is available with a selectively coated pressure sensitive adhesive (PSA).
 
Soft-Shield 4850 is RoHS compliant and has operating temperatures ranging from -40° C to 70° C.
 
www.chomerics.com

DegreeC presents the F600 sensor, designed for board-mounted, embedded applications in which in-situ airflow sensing is necessary. The product gives real time airflow and temperature information to prevent critical thermal situations.
 
Mounting pressure monitors critical components. PCBs are able to warn of impending shutdowns due to fan failure or air blockage. The overall velocity ranges from 0.5 m/s to 5.0 m/s, and the sensor has an accuracy of ±10% of reading. The profile remains low on the PCB because of the small footprint design (0.500 inches).
 
Small omni-directional heads mean minimal distortion of the true airflow picture. The heads can measure air velocity and airflow temperatures across the board’s surface. 
 
www.degreeC.com