Micropelt GmbH introduces
TE-Power NODE, the first
thermo-powered wireless sensor system. Thermal energy, taken from temperature
differentials, is used to operate a wireless sensor node, providing a
battery-free operation.
The product consists of a 60 mm by 27 mm footprint aluminum
base plate, carrying two Micropelt MPG-D751 thermo generators. This allows the
energy supply to be tailored to the application. Threaded heat spreaders,
mounted on the thermo generators, provide easy access and repair.
TE-Power NODE uses ultra-low-power technology from Texas
Instruments, and supports both IEEE 802.15.4-compliant and custom solutions.
Enthone has introduced an organic metal-based nanofinish, OrmeSTAR Ultra final finish. According to the company the process consumes approximately 90% less energy, reduces process time by 75% and lowers cost by 30% compared to an electroless nickel / immersion gold (ENIG) process.
Features include a surface conductivity comparable to pure gold and signal transmission that outperforms ENIG finishes. The solder bonds directly to copper to form strong solder joints. The durable coating allows for wipe downs on misprinted assemblies with no copper oxidation. Hold time between thermal cycles is similar to other metal finishes.
The nanofinish generates a visible coating that allows for ease of inspection and high first-pass yields with no false failures at in-circuit test. Application during PCB fabrication can occur before electrical test.
OrmeSTAR Ultra bonds with copper without a displacement reaction, increasing bath life. Low application temperatures, minimal water usage and long bath life make OrmeSTAR Ultra an environmentally friendly HASL alternative.
Würth Elektronik introduces Lasercavity that combines laser machining technology and thermo-compression bonding to integrate active components into PCB innerlayers. The technique uses lasers to generate a cavity in the innerlayer where a flip chip can then be incorporated using thermo-compression bonding techniques.
A laser cavity of up to 300 µm is carved out in the PCB innerlayer. Laser technology provides high precision for both the cavity dimension and depth. The cavity is then coated with an adhesive. The flip chip is placed by a die bonder and the adhesive is cured under pressure. The chip stud bump connections are also soldered at the same time.
Process creator, Roland Schönholz, product manager HDI-microvia at Würth Elektronik said the Lasercavity process is exciting because of its simplicity and efficiency.
Reliability testing of Lasercavity-PCBs has been conducted. In the testing, that used thermal shock and long-time temperature exposure, the bonding joint between the PCB and the flip chip demonstrated high reliability.
KEMET Corporation has released a complete line of capacitor models that are adapted to Mentor Graphics simulation software. These capacitor models allow SI, PI and board design engineers to model the decoupling scheme of a printed circuit board using the Mentor HyperLynx 8.0 PI and HyperLynx SI products.
The low ESR and low ESL polymer products are designed for the high speed processor board level decoupling applications. Using these models design engineers can model the time-domain and frequency behavior of aluminum, film, ceramic, and tantalum SMD capacitors.
Chemcut Corporation 2300 Series product line is based on the 2315 series and designed for compact applications. The new 2300 Series provides a reliable, high performance, compact, easy to install platform for the PCB manufacturing, chemical milling and sign and name plate industries.
The 2300 Series can be configured for most of the common wet processes including; resist developing, resist stripping, chemical cleaning, alkaline etching, cupric etching, and ferric etching.
Available in 15 inch and 20 inch widths, the 2300 Series is ideally suited for prototype shops, captive development facilities, quick-turn shops and any circuit board or chemical milling facility needing an additional processor for a specialized application. Many popular rinse and drying configuration options are available to meet a variety of processing requirements.
Master Bond Inc. introduces EP21AN, a two-part adhesive system. It cures readily at ambient temperatures and quickly at elevated temperatures. The product is reported to be an excellent electrical insulator with a dielectric strength of >400 volts/mil. The adhesive has been designed with a non-critical 1/1-mix ratio by weight or volume. It adheres to numerous substrates, such as metals, ceramics, glass and many plastics. With a low shrinkage upon cure, EP21AN is reported to show exceptional dimensional stability. It is available in ½ pint, pint, quart, gallon and five-gallon kits. www.masterbond.com
