Samtec Inc. introduces Q Rate high-speed and controlled impedance interconnects. The product combines the features of Samtec’s first- and second-generation Q series with Edge Rate signal integrity contacts.
 
Performance is reported to be 10 GHz/pin for single-ended signaling at –3 dB insertion loss. For differential pair configurations, performance is reported to be 15 GHz/pair. Broadside coupling is reduced and a connector width of less than 5 mm is allowed through the use of Edge Rate contacts.
 
www.samtec.com

W.L. Gore & Associates Inc. introduces GORE AIRMAX Assemblies, enabling high data rate signals to be transmitted over greater distances while maintaining fidelity and reliability. An extension of Gore’s 2 mm product family, this cable assembly can transmit signals up to 10 Gigabits per second. Available in a variety of configurations, they can be customized for pin out, cable type and latching features.
 
www.gore.com

IO Methodology Inc. introduces SignalMeth, a high-performance waveform/signal post-processing utility tool. Designed for signal integrity analysis and processing, its features include advanced signal/waveform viewing, preset/programmable SI analysis and a signal/waveform comparison capability. SignalMeth can load numerous format signal/waveform files from tools, scopes and text.
 
www.iometh.com

Pacothane Technologies LLC introduces PACOFLEX 5000. This conformable release film has been designed to increase production yields and to simplify and standardize the laminating process. It is reported to control and to eliminate reworks and rejections that result from factors that produce scrap, such as excessive adhesive flow, crushed pads, discoloration and high levels of distortion and misregistration.
 
PACOFLEX has very low X-Y Axis movement and provides micro Z-Axis control for sidewall conformance. It is clean, inert and disposable; it has no contaminant or solvent out-gassing. Entrapped air between the cover-layer and the circuitized base laminate is eliminated, increasing production yields.
 
The product dams back acrylic and epoxy adhesives, as well as reduces excessive resin flow into cover-layer clearance areas. It meets MIL-P 50884 and IPC-6013 Specifications.   
 
www.pacothane.com