Printed Circuit Design & Fab Online Magazine - New Products

New Products

Würth Elektronik introduces Lasercavity that combines laser machining technology and thermo-compression bonding to integrate active components into PCB innerlayers. The technique uses lasers to generate a cavity in the innerlayer where a flip chip can then be incorporated using thermo-compression bonding techniques.

A laser cavity of up to 300 µm is carved out in the PCB innerlayer. Laser technology provides high precision for both the cavity dimension and depth. The cavity is then coated with an adhesive. The flip chip is placed by a die bonder and the adhesive is cured under pressure. The chip stud bump connections are also soldered at the same time.

Process creator, Roland Schönholz, product manager HDI-microvia at Würth Elektronik said the Lasercavity process is exciting because of its simplicity and efficiency.

Reliability testing of Lasercavity-PCBs has been conducted. In the testing, that used thermal shock and long-time temperature exposure, the bonding joint between the PCB and the flip chip demonstrated high reliability.

www.we-online.de

KEMET Corporation has released a complete line of capacitor models that are adapted to Mentor Graphics simulation software. These capacitor models allow SI, PI and board design engineers to model the decoupling scheme of a printed circuit board using the Mentor HyperLynx 8.0 PI and HyperLynx SI products.

The low ESR and low ESL polymer products are designed for the high speed processor board level decoupling applications. Using these models design engineers can model the time-domain and frequency behavior of aluminum, film, ceramic, and tantalum SMD capacitors.

www.kemet.com
www.mentor.com

Chemcut Corporation 2300 Series product line is based on the 2315 series and designed for compact applications. The new 2300 Series provides a reliable, high performance, compact, easy to install platform for the PCB manufacturing, chemical milling and sign and name plate industries.

The 2300 Series can be configured for most of the common wet processes including; resist developing, resist stripping, chemical cleaning, alkaline etching, cupric etching, and ferric etching.

Available in 15 inch and 20 inch widths, the 2300 Series is ideally suited for prototype shops, captive development facilities, quick-turn shops and any circuit board or chemical milling facility needing an additional processor for a specialized application. Many popular rinse and drying configuration options are available to meet a variety of processing requirements.

www.chemcut.net

Master Bond Inc. introduces EP21AN, a two-part adhesive system. It cures readily at ambient temperatures and quickly at elevated temperatures.

The product is reported to be an excellent electrical insulator with a dielectric strength of >400 volts/mil. The adhesive has been designed with a non-critical 1/1-mix ratio by weight or volume.

It adheres to numerous substrates, such as metals, ceramics, glass and many plastics. With a low shrinkage upon cure, EP21AN is reported to show exceptional dimensional stability. It is available in ½ pint, pint, quart, gallon and five-gallon kits.

www.masterbond.com

DuPont introduces Pyralux APR copper clad resistor laminate. The product is a double-sided construction of polyimide film bonded to copper foil and used in advanced multi-layer flex, rigid flex and rigid PCBs. It features Ticer Technologies TCR thin film copper resistor foil as one or both of the clad foils.

Available in a range of dielectric thicknesses and resistance levels, the laminate provides a variety of circuit constructions. It is compatible with printed wiring board processes and has a thermal resistance up to 180° C.

Having embedded capacitance and resistance, the product is reported to have excellent dielectric thickness tolerance and electrical performance. It is also IPC 4204/11 certified.

www.pyralux.dupont.com

Murata Power Solutions introduces the HPQ series, ultra-high power quarter brick isolated DC/DC converter.

The product has a voltage output range of 36 VDC to 75 VDC and basic insulation up to 2250 V. Fixed output voltage is regulated to within ±1% and can be trimmed to within ±10% of nominal output.

The module has a 3.3 VDC fixed output. With an output current of up to 50 A, it can provide as much as 165 W of power. Designed for PCB mounting, the module is suitable for use across -40° C to 85° C. An optional baseplate is available.

www.murata-ps.com