Printed Circuit Design & Fab Online Magazine - New Products

New Products

CoreEL Technologies introduces the H.264 decoder IP solution. The decoder has a maximum resolution support of 1920 x 1080 at 60 frames per second. It supports 4:2:0, 4:2:2 and 4:4:4 chroma formats and has a programmable 8-bit to 12-bit depth.

The product can decode full HD at optimal frame-rates at 125 MHz clock frequency, with CABAC/CAVLC running at 50 Mbps and 100 Mbps respectively. It can support both Panasonic AVC and H.264 Inter frames decoding.

The decoder runs on Xilinx Virtex-5 FPGAs and has Verilog source code/netlist, a test branch, test data and complete technical documentation.

www.coreel.com

ANSYS Inc. introduces Simplorer 8.0 software for mechatronic and multi-domain system design.

Features include IGBT device and power module characterization tools, an online model database that has over 1,200 SPICE models and co-simulation links with Verilog.

Engineering time and prototype iterations are reduced, while electrical, mechatronic, power-electronic and electromechanical system design performances are improved. The software allows users to model, simulate, analyze and optimize complex systems.

The modeling features and communication backplane technology allows engineers to construct virtual prototypes of all aspects of a system. Users can utilize multiple modeling techniques such as block diagrams, circuits and state machines. The interface supports multi-page designs and multiple hierarchy levels.

www.ansys.com

ROGERS, CT – Rogers Corp. has released a materials selection guide for its BISCO Silicone material.

The 16-page guide contains specification tables for cellular and solid grade silicones, as well as specialty silicones. The guide also includes product samples and tips for selecting materials based on applications.

To obtain a copy of the BISCO Silicone Material selection Guide, phone 800-935-2940.

www.rogerscorp.com

DuPont Printed Circuit Materials introduces Riston LDI7200 and Riston LDI8000, LDI dry-film photoresists for advanced printed wiring boards.

LDI7200 is designed for use with 355-nm LDI equipment. It combines enhanced adhesion and precise plating with clean and fast stripping, increasing productivity.

LDI8000 was design for use with 405-nm light sources. It has a photospeed of 13 mJ/cm2~ and excellent resolution with wide exposure latitude. Features include good conformity, vivid printout image and strong tenting with excellent hold time stability.

www.DuPont.com

AcAe-Software introduces DART Design Migration Technology, EDA migration software. DART supports intelligent migration of PCB layouts, schematics and constraints.

Features include detailed migration verification reporting and customizable property mapping override. DART supports migration from DxDesigner, Expedition, Allegro Design Entry HDL and Allegro PCB Design, with additional vendor tools and platforms planned.

www.acae-software.com

Hollingsworth & Vose introduces ViaMat, nonwoven aramid paper. It is reported to improve dimensional stability and to enable higher interconnect densities in electronic packaging applications.

The fibers are randomly aligned, creating an isotropic nonwoven paper that allows for uniform density and resin pickup. A low CTE provides dimensional stability, and the surface smoothness allows uniform resin application.

Saturation of the product can be processed on most existing glass resin saturation lines with minimal cost. Interconnect density is increased over industry standard woven materials because of the product’s laser/plasma ablation and drill ability.

www.hollingsworth-vose.com