Printed Circuit Design & Fab Online Magazine - New Products

New Products

The Media and Precision Technology Co of Dainippon Screen Mfg Co Ltd has released PI-9500, a printed circuit board (PCB) pattern inspection system. The PI-9500 can inspect fine-line boards with lines and spaces as low as 7.5µm. The company claims the system has the world’s fastest inspection speed. The PI-9500 can inspect up to 49, 7.5µm fine-line circuit board images per hour. Automated inspection reduces preparation time. A new inspection algorithm improves detection capability for opens and shorts. Improved illumination improves the image capture.

www.screen.co.jp

The Media and Precision Technology Co of Dainippon Screen Mfg Co Ltd has released MI-9500, a mask inspection system. The MI-9500 incorporates an upgraded image processing unit and new digital interpolation technology to improve inspection of photomasks for fine-line circuit boards with line widths as low as 7.5µm. A new defect detection algorithm improves the MI-9500’s ability to locate tiny defects. The MI-9500 uses an open/short pattern matching inspection technique to improve detection of opens and shorts. The unit is suitable for use in a clean room.

www.screen.co.jp

SlimStack connectors from Molex Inc. provide board-to-board connection with a 0.40 mm (.016”) pitch that offers an ultra-narrow width of 2.60 mm (0.102”).

The connectors have a profile height of 1.00 mm (0.039”), but can provide greater space savings than many 0.90 mm (0.035”) height versions. The SlimStack housing allows for PCB circuit patterns to be run underneath the connector to provide design flexibility and space savings.

The SlimStack series is available in 20 to 80 circuits and are suited for tight-packaging applications such as mobile phones, digital cameras or portable audio units.

The SlimStack series features gold-plated grounding and soldering tabs that save space while providing secure PCB retention and electrical grounding.

SlimStack board-to-board connectors that are available in pitch sizes from 0.40 to 1.00mm (.016 to .039”) and stacking heights from 0.90 to 20.00mm (.035 to .787”).

www.molex.com.

Ucamco introduces Integr8tor v.4.1.2. The latest version of the automatic data input and analysis tool is reported to increase front-end throughput by up to 30%.

Job parameters are provided for fast and accurate quotations, allowing higher throughput through the front-end tooling process.

Integr8tor can run in a UCAM or Frontline Genesis environment.

www.ucamco.com

Agilent Technologies Inc. introduces Advanced Design System (ADS) 2009 Update 1, the industry’s first complete front-to-back solution for MMIC and RF module design.

The release integrates wireless standards-based design verification libraries, 3D EM analysis, X-Parameter simulation and statistical design and yield optimization.

Designers can stay within the design and simulation platform of choice for the entire design cycle, eliminating the need for separate, time-consuming point tools.

Features include an X-Parameter simulation model generator, delivering fast, drop-in useable and accurate nonlinear behavioral models; integrated planar and 3D EM simulation and analysis, allowing designers to account for EM effects from packages and interconnects without import/export of data or models; and an MMIC layout personality, allowing one-click access to MMIC layout functions.

In addition, designers can interactively modify settings in real time using the Optimization Cockpit.

www.agilent.com

Mentor Graphics Corp. introduces PADS 9.0, allowing designers to employ many of the company’s technologies for design, analysis, manufacturing and multi-disciplined collaboration.

Users can design products from standard to the most complex, highest performance and densest PCBs. Manufacturing and collaboration tools, core design entry and layout enhancements and powerful thermal, signal and power integrity analysis have been added.

Features include a 3D viewer that provides a design’s true 3D representation and the DxDesigner tool that gives a complete system design capability in a single user environment.

Padstack creation has been improved, allowing rounded and chamfered corners, and PADS 9.0 includes new outputs, such as IPC356 netlist and a “flat” DXF file.

Users are able to integrate many of Mentor’s advanced technology offerings, including HyperLynx Analog, I/O Designer, HyperLynx Signal Integrity and Power Integrity, the viseECAD tool and HyperLynx Thermal.

www.mentor.com