California Micro Devices introduces the CM1624, a microSD interface protection filter for mobile and computing devices. The product protects against ESD damage to the flash memory card or hardware, as well as curbs EMI, while providing digital signal integrity. Features include: rise times as fast as 5 nSec with 75 MHz clocks in a 50-ohms environment; low line capacitance of 12 pF at operating voltages; and attenuation from 700 Mhz to 3 GHz. The CM1624 has integrated pull-up resistors, removing the need for additional circuitry on the PCB handset and lowering costs. It is available in an industry standard, compact, RoHS-compliant microDFN16 package.
ANSYS Inc. introduces Icepak 12.0 software, providing robust and powerful fluid dynamics technology for electronics thermal management.
The latest version contains several advancements, including technology for meshing complex geometry and physical modeling capabilities.
The software quickens product development by accurately simulating dissipation of thermal energy in electronic devices at the component, board or system level. Users can improve design performance, reduce the need for a physical prototype and shorten time to market.
ANSYS Iceboard and Icechip capabilities are integrated into this latest version, and ECAD designs can be directly imported. Additional features include enhanced fan modeling, parallel processing, post-processing and expanded libraries.
In addition, a PCB trace Joule heating modeling capability, together with the import of DC power distribution profiles from Ansoft SIwaveT software enhances accurate PCB thermal simulation.
Leader Tech Inc. introduces its CBS Product and Design Guide, a board-level shielding catalog and engineer’s design guide. The brochure contains detailed information regarding standard, modified standard and custom CBS products. Features include: a quick-glance product comparison chart, cover retention data and shielding performance published for each CBS series. In addition, emerging EMI shielding design and manufacturing processes have a complete section in the guide, which can be downloaded free from the company’s website: www.leadertechinc.com.
SIwave v4.0 is capable of broadband signal- and power-integrity analyses along with DC voltage and current analysis for complete boards and packages. According to Ansys, SIwave v4.0 has the ability to couple board and package electromagnetic fields with HFSS(TM) technology for complete system-level simulation. Enhanced GUI aids component management and allows simultaneous analyses and dynamic zooming. Software includes automated error checking and geometry correction and allows native merging of packages to boards.
Version 4.0 includes new features for signal-integrity, power-integrity and electromagnetic compatibility testing, providing accurate solutions beyond 10 Gb/s. Links to other products can enable accurate characterization of additional heating due to copper-resistive losses that have previously been estimated or ignored completely.
This latest release includes multiple automation enhancements that ease design flows by removing manual manipulations. Automated error checking and geometry correction have been implemented. Schematic creation, transient and QuickEye analyses setups have been automated for circuit simulation driven by electromagnetics when using SIwave with Ansoft Designer.
Ucamco introduces UCAM v 8.4.1, the latest version of its PCB CAM software. UCAM v 8.4.1 supports multitasking 64-bit Windows software, and users can simultaneously run several programs on the same workstation. Features include a faster, more intuitive link the Integr8tor, the company’s sales tool, and menu-driven automation provides complete control and single-click operation without the need for special programming. Support for ODB++ v7 allows UCAM to link seamlessly to other CAM and assembly programs. One-click functions allow users to remove unused innerlayer pads, set special clearances for fiducial pads and optimize track runs on flexible circuits.
Fujipoly Zebra Gold 8000 Series elastomeric connectors provide excellent board-to-component electrical contact for broad-ranging commercial and military applications.
The connector delivers a high current carrying capacity of 250-500 mA amps per wire while exhibiting an electrical resistance of only 25-50milliohms. The Zebra® 8000 Series connector is constructed from a low durometer silicone core that is covered with parallel rows of flat, gold-plated conductors ranging from 100 to 166 wires per inch. These unique design and performance characteristics allow the interconnect device to accommodate pad spacing as close as .020” centers.
