Circuposit 3350-1 electroless copper offers plating coverage and reliability, stable operation, and reduced chemical consumption and waste generation for MLB (Multi-Layer Board) and HDI applications. Circuposit 7800 desmear is for semi-additive processes and is said to offer uniform and stable adhesion promotion treatment and reliable via bottom cleaning. Reportedly provides excellent plating coverage, high peel strength and reliability. Circuposit 3323A Conditioner is a biodegradable conditioner for plated-through hole processes, offers excellent coverage and lower surface tension.
Dow Electronic Materials, www.dow.com