Printed Circuit Design & Fab Online Magazine - Dow Releases Microfill EVF Via Fill

Printed Circuit Design & Fab Magazine

Microfill EVF Via Fill is said to enhance via filling at low surface thicknesses and is capable of simultaneous through-hole plating. Is suitable for HDI and IC substrate applications.

Dow Electronic Materials, www.dow.com

JANUARY ISSUE

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From Boards to Assemblies: Precision PCB’s Journey to In-House Manufacturing
Tracking Giants: Inside the World’s Top PCB Fabricators
Tried-and-True Design Practices for High PCB Yield
The Analysis of Variance: Drawing Conclusions from Data that are Correct, Unambiguous and Defensible
On Flying, Finding and the Trade Show Floor

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Dow Releases Microfill EVF Via Fill

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