Printed Circuit Design & Fab Online Magazine - New Products

New Products

Huntsman Advanced Materials introduces Araldite EP100 A/B epoxy adhesive. The two-part, thixotropic paste has a 2:1 mix ratio and low viscosity for easy handling.

The epoxy comes in a dual-barrel cartridge mixing kit, providing a waste-free application, and the structural adhesive cures at temperatures ranging from ambient to 212° F.

It does not require autoclave cycling and is reported to have high lap shear and good peel strengths once cured. The epoxy can maintain more than 90% of its shear strength after exposure to aviation fuels and hydraulic fluids, as well as 25% to 30% of its physical properties at temperatures up to 300° F.

www.huntsman.com

Huntsman Advanced Materials introduces benzoxazine thermoset resins. Features include low shrinkage and water absorption, dimensional stability and low dielectric constant.

The resins are flame retardant and halogen-free and reported to have excellent high-temperature performance. Applications include coatings, adhesives and encapsulants.

www.huntsman.com

Centurion Specialty Chemicals has released Ristoff C-8, an alkaline solder mask stripper. According to the company, the product removes fully cured liquid photoimageable and UV screen printable solder masks from PCBs, leaving the surface ready to be reprocessed without the need for any secondary treatment like scrubbing or power washing.

Ristoff C-8 works on a variety of commonly used solder mask materials, including; Coates Imagecure Range, Probimer 77, Electra Carapace, Taiyo PSR Series, Tamura DSR Series and Lackwerke Peters Elpemer.

C-8 is supplied as a concentrate, and is diluted with water before use.

www.centurionchemicals.com

FPGA Planner System from Cadence Design Systems Inc. is a scalable co-design solution for designing FPGAs onto PCB systems. The FPGA Planner System (for OrCAD and Allegro) was developed by Taray Inc. and is available to Cadence customers through an exclusive OEM licensing agreement.

According to Cadence, the FPGA System Planner shortens the time it takes to integrate FPGAs on a PCB, enhances FPGA performance through the optimal utilization of FPGA resources and can reduce PCB manufacturing costs through a reduction in the number of PCB layers required to route dense, complex, large pin-count FPGAs.

The technology is available in a series of scalable solutions from the OrCAD FPGA System Planner to the Allegro FPGA System Planner L, XL and GXL tiers, and is tightly integrated with OrCAD Capture, OrCAD PCB Designer, Allegro Design Entry HDL and Allegro PCB Design products.

www.cadence.com

Ucamco reports that its front-end engineering throughput has increased up to 30%, following the launch of its new PCB CAM productivity service.

Based around advanced remote-access software, the service provides secure access to a customer’s workstation, no matter where it is located. The company’s software support engineers are able to observe and to record the complete data preparation process for several jobs. Based on UCAM software and industry best practices, a report is generated with suggested process changes and itemized timesavings.

New features can be downloaded to the customer’s workstation through the remote-access software, and online training is provided.

“Our reports quantify the specific benefits to be gained before the customer commits his cash,” says Filip Vermeire, head of software customer care. “The first audits we have done for customers have shown productivity increases up to 90% for specific operations and up to 30% overall.”

www.ucamco.com

Rogers Corporation introduces an online tool to support the PORON gap fill product line. The tool helps designers select the best PORON Urethane to meet their specific application needs.

The PORON Gap Filling Tool is an interactive tool that designers can customize to help select the right material to meet final gap thickness requirements. Designers can select a final gap thickness and optional adhesive thickness from a drop-down menu and get a list of suitable PORON materials for their specific application.

Designers select one or more of the PORON products to create a custom compression force deflection graph. This graph enables the user to "mouse-over" product curves to show actual compression force and final thickness values along any point on the curve.

www.rogerscorp.com