FKN Systek introduces the N200 punch to singulate round tab routed PCBs. The top down air-operated punch separates panels one tab at a time, while an upper and lower matching knife blade pinches the tabs apart. There is less stress placed on the PCB than a typical punch and die because the cutting occurs from both sides.
 
An adjustment screw determines the exact cutting location. Locating pins are mounted on quick-change blocks that are easily replaceable for different board configurations. Users can easily sigulate low volume prototype boards or a set of replacement panels from a previous order.  
 
www.Fknsystek.com

Simberian Inc. introduces Simbeor 2008.01, an electromagnetic tool for the physical design of PCB and packaging interconnects operating at 6 Gb/s to 100 Gb/s and higher.
 
Features include: geometry selection for quick and precise automatic de-compositional electromagnetic analysis of PCB interconnects; a recursive convolution simulator for time-domain compliance analysis of interconnects; and interpolative frequency sweeps that accelerate electromagnetic analysis.
 
“Simbeor is the industry-first electromagnetic tool developed for the signal integrity and EMI engineers to enable the smooth transition into the microwave domain at low cost,” said Yuriy Shlepnev, president and founder of Simberian.

www.simberian.com

Dow Epoxy introduces PROLOGIC Epoxy Specialty Materials, a group of resins, systems, additives and curing agents for electrical laminates that can pass UL94 flammability requirements.
 
Included in the product line are: BF190D and BF190DF, bromine-free epoxy products that allow potential laminate formation with Tg exceeding 190° C.; PE-103, patented oxazolidinone resins for laminate formation requiring Tg greater than 170° C.; and BF150D and BF150P, bromine-free epoxy resin systems for laminate formation requiring Tg greater than 150° C.
 
www.epoxy.dow.com

RBP Chemical Technology introduces FoamFREE ONE for primary image developers, strippers and solder mask developers. It is a silicone-free non-solvent that suppresses foaming at very low usage levels.
 
FoamFREE ONE leaves no residue behind or in the machine. In addition, the free-rinsing agent lowers costs and chemistry consumption.