Sigrity Inc. introduces XtractIM Version 3.0, establishing a new industry standard for IC package modeling. According to the company, this latest version enables designers to find weak pins with a push of a button.
 
The tool’s electrical performance assessment capabilities are extended with a signal net assessment analysis and results display. Self-impedance and coupling to other nets are computed and displayed, so designers are able to pinpoint performance issues in complex designs efficiently and intuitively.
 
Designers can assess performance of signal and power delivery nets, characterize a broader set of package types and extract electrical models with improved accuracy.
 
XtractIM Version 3.0 supports quad flat pack, quad flat pack no leads and VQFP. It provides both a practical assessment method for complex SiP power delivery nets and support for single-die packages.
 
www.sigrity.com

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