Printed Circuit Design & Fab Online Magazine - New Products

New Products

JD Photo-Tools introduces GerbTool scripts, a set of automated scripts that run within GerbTool/VisualCAM suites of software.

The scripts are automated macro programs designed to run within the GerbTool shell. Users can create off-line programming from data sets, increasing PCB assembly productivity. Included is a Component Edit facility that allows users to search, find and highlight components on screen.

The product can be configured to match existing format requirements and supports metric and imperial codes. VisualCAM users can use the scripts as an entry-level alternative to powerful ARE modules that allow SMT/BOM capabilities.

www.jdphoto.co.uk

Mentor Graphics has released a power integrity analysis tool, HyperLynx PI, which according to the company provides easy-to-learn-and-use setup and accurate analysis of power plane structures.

Targeting the design of high-performance electronic products, HyperLynx can assist design teams in the optimization of the working power delivery system. To address high density/pin-count ICs, the power delivery system analysis tool analyzes the design, ensuring that clean, sufficient power is delivered to the ICs through multiple PCB power and ground structures.

The HyperLynx product provides analysis that is both visual and textual, allowing the designer to identify and resolve issues. The analysis tool can provide accurate analysis of the power integrity, enabling designers to determine the best number, placement and values of the de-coupling capacitors. PI analysis facilitates designers experimenting with PCB fabrication materials and stack-up when determining the best electrical and cost solutions, allowing designers to optimize the performance of advanced designs while avoiding the need of costly prototypes and re-spins.

www.mentor.com

USA Technical Machine Products introduces the Eco-Lab Press. The hydraulic press uses less energy to cool platens during press temperature cycling.

A multi-stage cooling process employs forced air to initially cool the platens. After the product reaches 500° F, it is transferred to a cold press. Sweating is eliminated and water usage reduced because water flows only to the cold press platens when needed.

The press has a temperature control accuracy of ±0.25% and a platen temperature uniformity of ±2.5% of set point. The control system includes a 12-point paperless recorder and complies to all NEC, NFPA 70E and NFPA 79 codes.

www.techmach.com

Molex Inc., in conjunction with Neoconix, introduces the Molex FlexBeam Tool-Less Copper Flex Interposer. The high-speed, copper flex assembly from Molex joins Neoconix’s HD&S PCBeam interposer to provide high-density interface for flex-to-PCBA applications.

The product is a low profile, flex-to-board interface providing densities of 1.00 mm or less in numerous pin-matrix configurations. A z-axis is added to traditional 2D PCB processing through all-metal spring beams permanently embedded onto an FR-4 substrate.

With photolithography and etch-based processes, the interposer provides dimensional control that is scalable to very fine feature sizes for applications having space constraints. The integrated copper flex assembly enables signal speeds greater than 10 Gbps and single-ended speed of 4 GHz and higher.

Users can achieve board-to-flex pin counts of 500 input/outputs or greater, and a dual-beam option is available for contact redundancy in high-reliability applications.

www.molex.com

Vishay Intertechnology Inc. introduces IHLW-5050CE-01, IHLP inductor.

This is the first winged, low profile, high-current inductor and is designed to be placed on a cut-out PCB. It offers a high-current solution without exceeding a 1.2-mm profile on either side of the board.

With a frequency range up to 5 MHz, the product is reported to handle high transient current spikes without hard saturation. Specified for operating temperatures ranging from 55° C to +125° C, the product is RoHS-compliant and resistant to thermal and mechanical shock, moisture and vibration.

www.vishay.com

Rogers RO2808 material combines high dielectric constant with a thin dielectric thickness to achieve high capacitance per unit area. Electrical performance enhancements can significantly increase density of integrated components and reduce the package module footprint.

The ceramic filler improves dimensional stability, laser machining and surface topography. Features include low dissipation factor and low copper profile options that offer low loss and high Q factor for signal propagation in fine line/space, high I/O count designs.

RO2808 is available with a dielectric thickness of 0.0011 inch +/- 0.00017 inch. This is supplied with one-half ounce, low profile copper foil with a 0.0950 µm treated side root mean square surface roughness. RO2808 is also provided as a bonding film.

www.rogerscorp.com/acm/index.aspx