Printed Circuit Design & Fab Online Magazine - New Products

New Products

DesignAdvance Systems, Inc. introduces CircuitPlan, a concept level planning tool for the hardware engineer. CircuitPlan offers planning, feasibility and design collaboration from concept level planning through physical design and test.

As a concept level planning tool, CircuitPlan supports full logical and physical hierarchy. CircuitPlan provides a mechanism to begin design by populating preliminary plans with design data, including mechanical, from previous and existing designs or reference boards (both partial or complete netlists).

Floor Planning and Conceptual Product Planning Capabilities include:
-- Feasibility Analysis [multi-level fit studies]
-- Plan with generic or pseudo components and/or CircuitSpace templates
-- Concurrent syncing with schematic allows the user to replace generic or
    pseudo components with schematic completed components
-- View Functional and Physical Design encompassing inter-view
    connectivity
-- Populate your Design with data from previous designs and reference
    boards
-- Import/Export into IDF and/or leading PCB design flows
-- Placement Automation Capabilities
    - Interactive Clustering
    - Replication of exact/partial clusters
    - Modify and propagate changes

- Apply templates

CircuitPlan v1.0 will be available in February 2009.

Aries Electronics introduces the CSP/BallNest Hybrid Socket for test or burn-in of chip scale package, ball grid array, microBGA, land grid array and prototyping.

It can be used on any device having a pitch of 0.30 mm or larger. Features include a lid that nests each ball termination into the socket for a reliable connection and a four-point crown providing scrub on solder oxides.

It has a signal path of 0.0777 inches and provides minimal signal loss for higher bandwidth capability. Estimated contact life is 500,000 cycles, and the socket is available in custom materials, sizes, configurations and platings.

www.arieselec.com

Fluke Corp. introduces Fluke Application Notes to aid electricians and electronics professionals with Fluke digital multimeter (DMM) advanced electrical testing. Available through the company’s website, the notes assist users with troubleshooting and illustrate the features and techniques of the Fluke test tools.

Features include a dual impedance capability that provides safe and accurate testing of industrial, electrical and electronic systems. Technicians are able to safely troubleshoot sensitive circuits, including ones that might contain ghost voltages.

www.fluke.com

3M introduces the Shielded Controlled Impedance (SCI) Cable Assembly Development Kit, 2mm. The development kit enables users to assess, test and design high-performance, 2mm SCI cable-to-board solutions. Engineers can attain multi-gigahertz performance from 2 mm printed circuit board connectors using 2mm shielded controlled impedance cable assemblies.

The SCI connectors save board space without affecting performance. Users can verify signal integrity, impedance matching and crosstalk performance for designs requiring up to 1 Gbps single-ended performance per signal line or 5 Gbps differential performance per signal pair.

The kit contains everything needed to assess, test and design, including a CD-ROM with application note, test instruction and technical sheets.

www.3m.com

MYNAH Technologies introduces MiMiC v3.1.0, simulation software for operator training and automation system testing. Up to 10 users can access the same application from Microsoft Windows XP or Vista desktop.

Features include an enhanced MiMiC Operator Training Manager. Development and execution of operation training sessions is supplied while providing additional flexibility and capabilities. Users can configure training scenarios, take Process Snapshots and run sessions directly from MiMiC Explorer.

The enhanced OPC Server provides open access to process models, operator-training scenarios, process snapshot controls and global registers. Users have access and integration with third-party simulation packages or data visualization systems.

www.mynah.com

MISUMI USA, INC. introduces magnetic transmission drive components, providing a design option for low dust generating applications on assembly or transfer mechanisms. The components function without contact because they operate on the principle of attractive force. Type MDQ allows perpendicular alignment; Type MDY provides parallel alignment.

Housed in 5056 aluminum with a gas emission prevention treatment, the components are available in outside diameters from 16 mm to 35 mm and inside diameters from 6 mm to 20 mm. Applications include cleanroom assembly operations in the circuit board, aerospace and consumer electronics market.

www.misumiusa.com