New Products

Ucamco introduces  Integr8tor v.4.1. Integr8tor is an automatic input and analysis tool designed to increase front-end throughput by up to 30%. Automatic data input and design analysis capabilities provide job parameters for fast and accurate quotations.
 
Version 4.1 features a user interface based on Adobe’s Flex. Integr8tor runs securely on major browser and desktop systems, and a downloadable active PDF Request For Quotation form allows users to input non-CAD job parameters in a format that is directly read by Integr8tor. This saves time and reduces errors.
 
The latest version allows users more options to intervene directly where data is ambiguous or incomplete. Integr8tor runs in both Ucamco UCAM and Frontline Genesis environments.
 

Zuken introduces E³.panel, a panel design system with integrated 3D functionality. It allows the physical representation of cabinets to be designed and developed, offering an easy-to-use solution for panel layout and wiring.
 
E³.panel is an add-on option for E³.schematic or E³.cable, with complete online integration. Features include interactive and automatic wire routing, automatic and interactive placement with online checks and cable duct fill calculations with graphical displays.
 
In addition, determined data can re reused for production. Information is synchronized online, regardless of where design changes have been made.


EMA Design Automation introduces Component Information Portal (CIP) Version 2.2, for design capture and data management. The latest version of CIP adds 800 additional parts to the existing foundation library and increases the CIP Enterprise foundation library to more than 5,000 parts.
 
Designed for multi-user environments with more complex data management requirements, CIP Version 2.2 takes advantage of the relational database support in Cadence OrCAD Capture CIS 16.2.
 
The advanced export feature allows users to update an external list of parts with information from the CIS database. CIP Enterprise can convert an OrCAD Capture CIS BOM into a BOM that is hierarchical, showing the manufacturers linked to each company part number. In addition, engineering teams can manage component data via the CIP web-based browser.
 
www.ema-eda.com
International Manufacturing Services Inc. introduces the VGX-2010WA for high power RF and microwave applications.
 
The high power, 2010-size chip attenuator features wraparound terminals for solder or epoxy attachment. It is reported to dissipate 20 W at a 100° C baseplate temperature and has a standard impedance of 50 ohm.
 
Attenuation values to 30 dB are available, including 0.5 dB increments. Attenuation accuracy starts at ±0.2 dB. Depending on implementation, achievable VSWR is 1.3:1 to 12 GHz.
 

RBP Chemical Technology Inc. introduces MetalTreat 530, MetalTreat 4007 and MetalTreat 957, a waste treatment process for electronics and metal finishing.
 
MetalTreat 530 precipitates metals out of solution, and MetalTreat 4007 coagulates the waste metal. This metal waste is then flocculated by MetalTreat 957. This three-step process produces a solid waste cake that can be easily removed from the bath.
 
The chemicals are non-DOT regulated and non-hazardous. MetalTreat 530 is free DTC, preventing aquatic toxicity. It can also be used with ORP metering. MetalTreat 957 is packaged in suspension, providing easy handling. MetalTreat 4007 is effective in both PCB and metal finishing applications.
 
www.rbpchemical.net
3M introduces an Ultra Hard Metric (UHM) socket connector, providing multi-Gigabit performance to hard-metric, compact PCI, VME and PXI systems.
 
The socket connector is reported to deliver more than 7 Gbps of backplane performance for systems based on 2-mm, hard-metric connectors. Users can increase overall system performance while maintaining existing investments.
 
Able to mate with both industry-standard and 2-mm, hard-metric header connectors, the socket provides design flexibility for engineers and supports 100 ohm differential pairs in rows or columns. Five-row (A, B, CL, CR, AB) and eight-row (D, E, DE, FL, FR) form factors are available for high signal density.   
 
www.3M.com

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