Printed Circuit Design & Fab Online Magazine - New Products

New Products

Molex introduces EdgeLine, low-cost connectors that support high-speed signal transmissions using a card edge interface and a vertical or right angle insertion. EdgeLine includes a 12.5 Gbps stitched-terminal Edge Card connector and an insert-molded wafer CoPlannar connector.

The two press-fit connectors offer a common or simulated ground to manage power and slow-speed, single-ended signals, as well as high-speed differential circuits. Standard circuit sizes are available.

www.molex.com

Luceo Technologies GmbH introduces X-BERT Parallex, a parallel 10 Gb/s test platform. The cost per test port is reduced because users are able to perform several BER tests at once using a single clock and pattern source.

The platform is scalable, therefore, users can begin with a single channel and add modules if needed. In addition, it aids in the design and development of 8 Gb/s to 11.3 Gb/s optical and electrical transceivers.

www.luceotec.com

Ticona Engineering Polymers introduces Forton SKX-534 Black, engineering polymer. The product reduces total halogen concentrations to less than 900 parts per million, helping to meet environmental standards.

The polyphenylene sulfide (PPS) is inherently flame resistant. It is also UL94 V-O rated and can withstand high-temperature soldering to temperatures of 270° C.

www.ticona.com

Sonnet Software Inc. introduces SONNET Suites Professional Release 12 simulation software. Faster simulation is attainable through parallel processing on multi-core CPUs plus significant improvements in Sonnet’s matrix solve algorithms. Enhanced geometry and circuit structure variables allow most geometrical and material properties to be defined by equations.

Additional features include a Gerber import and export translator, uniaxial anisotropy in substrates and user defined hot keys. The software is accessible through Agilent ADS, Agilent Genesys, AWR Microwave Office and Cadence Virtuoso.

www.sonnetsoftware.com

Samtec Inc. introduces Q Rate high-speed and controlled impedance interconnects. The product combines the features of Samtec’s first- and second-generation Q series with Edge Rate signal integrity contacts.

Performance is reported to be 10 GHz/pin for single-ended signaling at –3 dB insertion loss. For differential pair configurations, performance is reported to be 15 GHz/pair. Broadside coupling is reduced and a connector width of less than 5 mm is allowed through the use of Edge Rate contacts.

www.samtec.com

W.L. Gore & Associates Inc. introduces GORE AIRMAX Assemblies, enabling high data rate signals to be transmitted over greater distances while maintaining fidelity and reliability. An extension of Gore’s 2 mm product family, this cable assembly can transmit signals up to 10 Gigabits per second. Available in a variety of configurations, they can be customized for pin out, cable type and latching features.

www.gore.com