Fico, a member of the Besi Group, has achieved a 40x performance enhancement with the development of a laser PCB depaneling system. This machine employs lasers to cut PCBs and memory cards. Because of the laser’s thin cuts, users are able to put 85% more components on the same area versus cuts made by a traditional router. A glass window protects the optics, and a dust chamber prohibits the laser light from escaping, as well as prevents the operator from ingesting harmful dust and smoke. The performance of the laser depaneling system was improved by the implementation of EFD.Pro fluid dynamics analysis software from Flomerics. The EFD.Pro was able to customize the airflow around the depaneling tool, reducing downtime associated with dust accumulation. After the customization customers reported 11 hours of non-stop production, and the companies claims there is room for further optimization and improvements using the Flomerics modeling tool. www.fico.nl.com www.flomerics.com
The NI Single-Board RIO device from National Instruments provides an integrated hardware option for deploying embedded control and data acquisition applications while remaining low in cost. The device merges an embedded real-time processor, reconfigurable field-programmable gate array (FPGA) and analogue, as well as a digital I/O, on a single printed circuit board. The combination allows for applications requiring flexibility, high performance and reliability in a small form-factor. The NI Single-Board RIO device includes an industrial 266MHz or 400MHz Freescale MPC5200 processor built on Power Architecture technology, Xilinx Spartan 3 FPGA and expandable I/O capabilities via three expansion slots that connect any future NI C-Series I/O module or custom modules. With an operating temperature of -20ºC–55ºC, it can be used in extreme temperatures, and it has integrated 19-30V DC power supply input and a real-time clock and battery backup. www.ni.com
TechFilm LLC introduces F2591, a flame retardant adhesive film that is RoHS compliant and meets ASTM standard D3801 flammability specifications. The film provides a strong adhesion to ceramic, silicon, aluminum and copper substrates and has a typical cure schedule of 150°C for 60 minutes. It is available in a sheet or roll format of up to 18" and comes in film or perform thicknesses of 1.5mils to 7 mils. www.techflim.com
ALL FLEX ACQUISITIONS, LLC introduces Flexible Heater Circuits capable of providing precision heat output to specific areas of equipment, electronics systems and various other applications. All Flex claims the product, comprised of flexible and lightweight polyimide material, can withstand temperatures up to 260Ëš F, resists most chemicals and can be custom built in a variety of irregular shapes, as well as conform to contours and 3-dimensional patterns.
Agilent Technologies rolls out Genesys 2008.07, whichexports RF board mask and artwork files to board fabricators, rapid-prototyping machines, and CAD/CAM software for physical product design. Graphical artwork previewer and pre-production editor allow designers to inspect masks for layer alignment issues and short/open circuits and make direct real-time adjustments. In addition to direct board fabrication, artwork tools let users import drawings for electromagnetic verification using Momentum GX planar-3D EM simulator.
Scapa North America introduces Scapa 519, a highly conformable, heat-resistant tape designed to mask printed circuit boards during solder stripping and nickel/gold plating of finger contacts. The non-silicone tape protects large areas of PCBs from chemical fumes and splashes. Scapa 519 consists of a conformable polyester film, single coated with a rubber adhesive that removes cleanly and offers controlled adhesion. The product's high-strength backing allows for easy application and removal. This chemically-resistant tape withstands temperatures as high as 250°F.