IO Methodology Inc. introduces SignalMeth, a high-performance waveform/signal post-processing utility tool. Designed for signal integrity analysis and processing, its features include advanced signal/waveform viewing, preset/programmable SI analysis and a signal/waveform comparison capability. SignalMeth can load numerous format signal/waveform files from tools, scopes and text.
 
www.iometh.com

Pacothane Technologies LLC introduces PACOFLEX 5000. This conformable release film has been designed to increase production yields and to simplify and standardize the laminating process. It is reported to control and to eliminate reworks and rejections that result from factors that produce scrap, such as excessive adhesive flow, crushed pads, discoloration and high levels of distortion and misregistration.
 
PACOFLEX has very low X-Y Axis movement and provides micro Z-Axis control for sidewall conformance. It is clean, inert and disposable; it has no contaminant or solvent out-gassing. Entrapped air between the cover-layer and the circuitized base laminate is eliminated, increasing production yields.
 
The product dams back acrylic and epoxy adhesives, as well as reduces excessive resin flow into cover-layer clearance areas. It meets MIL-P 50884 and IPC-6013 Specifications.   
 
www.pacothane.com

Vision Engineering introduces the SX45 stereo zoom microscope. Although it is affordable, it maintains a high level of optical performance. It has a zoom ratio of 6.3:1 and a magnification of x50.
 
A digital or USB camera can be used simultaneously, and a trinocular viewing attachment is available. Users can choose from numerous standard options, such as the bench stand, the boom mount and the articulated arm. Multimedia solutions are also available for image archiving, acquisition, processing, analysis and documentation.
 
www.visioneng.us

Advanced Interconnections Corporation introduces a compact socket adapter system. The hybrid design utilizes both male and female pins in an interstitial pattern, in 0.65 mm-pitch BGA and LGA footprints.
 
Designed for development and validation of BGA and LGA devices, production level socketing and SMT board-to-board connector applications, the system is 2.00 mm larger than the device package. No external hold-downs are necessary.
 
The adapter offers signal attenuation up to 3.5 GHz, and unique alignment pins assist in hand placement and protect the pin field. Optional stand-offs are available. Features include standard eutectic tin/lead solder balls or lead-free tin/silver/copper solder ball terminals for RoHS-compliant applications.
 
www.advanced.com