Printed Circuit Design & Fab Online Magazine - New Products

New Products

Daat Research Corporation introduces CoolitPCB v4.0, the cost-effective, easy-to-use CFD software that provides a thermal modeling option. PCB designers can perform board level analysis; predict thermal behavior of designs and pinpoint optimum component placement on boards.

The software allows designers to construct models of Ball Grid Arrays, Dual Inline Packages and Quad Flat Packages in detail. They can also select, modify and save IC packages from the extensive IC Package Library, saving the results. The models can be converted into compact models, allowing for rapid computation and saving valuable time.

www.daat.com

Cadence Design Systems, Inc. and ARM have collaborated on a hardware/software co-verification environment, the Cadence Incisive Palladium III that speeds up the system validation process to create a faster path to first silicon working with early software.

The acceleration/emulation system will be for advanced processor development. It will be used for in-circuit emulation, as well as transaction-based acceleration. Multimedia, graphics and network storage applications will be the focus, allowing customers to expand and accelerate their system validation ramp-up in these markets.

Based on a reference design utilizing the Palladium III system, ARM RealView Debugger, ARM processor IP and Cadence SpeedBridge adapters can demonstrates audio/video playback and capture of AVI and MP3 files, as well as Web browsing, software debugging and Linux boot. Using the collaborative environment, customers are able to ramp-up the ARM processor-based design system validation environments quickly.

www.cadence.com
www.armcorp.com

Linear Technology Corporation introduces the LT3085, part of the next generation of NPN LDOs. It has a 500 mA output current and offers input voltage capabilities from 1.2 V to 36 V. The output voltage is adjustable, ranging from 0 V to 35 V, while the dropout voltage is only 275 mV at full load. The outputs can also be paralleled for a higher output current or for easier heat spreading.

It is stable with ceramic, aluminum and Tantalum Capacitors and comes in two high power density packages; a thermally enhanced, 8-lead MSOP and a low profile, 6-lead DFN. Both packages can dissipate 1 W to 2 W in surface mount applications without requiring a heat sink. Safety features include thermal limiting and current limiting with foldback.

www.linear.com

Alpha-board GmbH introduces RFID labels for identification of PCBs in the medical technology industry. The space-saving technology provides improved readability and additional storage space for assembled PCB-related information. The adhesive label stores assembled, specific data.

The labels can be attached to small PCBs or flex boards. When a label cannot be attached, due to size or high packing density, a small TAG can be mounted, similar to a board component.

www.alpha-board.de

GIGABYTE announced that many of its upcoming motherboards will feature Ultra Durable 3. The company claims this is the first technology to use 2 oz. copper layers for the power and ground layers. The results should be creative heat spreading, resulting in lower system temperatures, up to 50 °C in some areas according to GIGABYTE. Increased efficiency, decreased chances of warping and greater headroom for over locking are also claimed. Integrated Japanese capacitors provide 50,000 hours of use.

www.GIGABYTE.com

Rogers Corporation introduces dur-E-volt LED driver, a constant-frequency, peak current mode control LED driver. The product allows an LED string to be driven at a fixed current, separate from the supply voltage. This provides improved reliability and constant light output. The dur-E-volt LED driver is able to support anywhere from one to hundreds of LEDs in series or parallel combinations, using fewer components. It is compact in size and is reported to be 90% efficient and to have excellent heat dissipation. High brightness LEDs (HBLEDs) from 8 VDC to 450 VDC can be supported efficiently. LED dimming can be controlled by two methods: by the PWM input pin or by adjusting the voltage to the LD/Linear Dimming pin. The driver is RoHS and WEEE complaint.

www.rogerscorp.com/durel