Rogers RO2808 material combines high dielectric constant with a thin dielectric thickness to achieve high capacitance per unit area. Electrical performance enhancements can significantly increase density of integrated components and reduce the package module footprint.

The ceramic filler improves dimensional stability, laser machining and surface topography. Features include low dissipation factor and low copper profile options that offer low loss and high Q factor for signal propagation in fine line/space, high I/O count designs.

RO2808 is available with a dielectric thickness of 0.0011 inch +/- 0.00017 inch. This is supplied with one-half ounce, low profile copper foil with a 0.0950 µm treated side root mean square surface roughness. RO2808 is also provided as a bonding film.

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